发明申请
US20130056872A1 Packaging and Function Tests for Package-on-Package and System-in-Package Structures 有权
包装封装和系统级封装结构的封装和功能测试

Packaging and Function Tests for Package-on-Package and System-in-Package Structures
摘要:
A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.
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