发明申请
- 专利标题: THERMAL CONDUCTIVE SHEET AND PRODUCING METHOD THEREOF
- 专利标题(中): 导热片及其制造方法
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申请号: US13606931申请日: 2012-09-07
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公开(公告)号: US20130062046A1公开(公告)日: 2013-03-14
- 发明人: Seiji IZUTANI , Takahiro FUKUOKA , Kunio NAGASAKI , Yusuke SUGINO , Kohei DOI
- 申请人: Seiji IZUTANI , Takahiro FUKUOKA , Kunio NAGASAKI , Yusuke SUGINO , Kohei DOI
- 申请人地址: JP Osaka
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 当前专利权人地址: JP Osaka
- 优先权: JP2011-197524 20110909
- 主分类号: F28F7/00
- IPC分类号: F28F7/00 ; B32B37/26
摘要:
A thermal conductive sheet is obtained by preparing a resin layer, laminating a particle-containing monomer mixture layer which contains a monomer to be absorbed in the resin layer and a thermal conductive particle on one side surface of the resin layer, localizing the thermal conductive particle at one side by allowing the monomer to be absorbed in the resin layer, and thereafter, reacting the monomer to be cured.