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公开(公告)号：US08749978B2
公开(公告)日：2014-06-10
申请号：US13016521
申请日：2011-01-28
申请人： Seiji Izutani , Hisae Uchiyama , Takahiro Fukuoka , Kazutaka Hara
发明人： Seiji Izutani , Hisae Uchiyama , Takahiro Fukuoka , Kazutaka Hara
IPC分类号： H05K7/20
CPC分类号： H01L23/3737 , H01L23/36 , H01L24/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/73265 , H01L2924/10253 , H01L2924/1301 , Y10T428/24917 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
摘要翻译： 功率模块包括功率模块板，其包括形成在绝缘层上的绝缘层和导电电路，设置在电源模块板上并电连接到导电电路的功率器件，以及用于耗散由 电源模块板和/或电源设备。 导热片包含板状氮化硼颗粒，并且在与导热片的厚度方向垂直的方向上的导热率为4W / m·K以上。
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公开(公告)号：US20130065987A1
公开(公告)日：2013-03-14
申请号：US13611372
申请日：2012-09-12
申请人： Saori Fukuzaki , Keisuke Hirano , Seiji Izutani
发明人： Saori Fukuzaki , Keisuke Hirano , Seiji Izutani
CPC分类号： H01L23/3737 , C08K3/22 , C08K3/28 , C08K7/08 , C08K7/18 , C08K2003/2227 , C08K2003/382 , C09J7/10 , C09J2205/102 , C09J2463/00 , H01L24/29 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2924/12041 , H01L2924/0665 , H01L2924/00
摘要： A thermal conductive sheet has a peeling adhesive force with respect to a copper foil of 2 N/10 mm or more, a thermal conductivity in a thickness direction (TC1) of 4 W/m·K or more, a thermal conductivity in a direction perpendicular to the thickness direction (TC2) of 20 W/m·K or more, and a ratio (TC2/TC1) of the thermal conductivity in a direction perpendicular to the thickness direction (TC2) with respect to the thermal conductivity in the thickness direction (TC1) of 3 or more.
摘要翻译： 导热片相对于铜箔的剥离粘合力为2N / 10mm以上，厚度方向（TC1）的热导率为4W / m·K以上，导热性方向 垂直于厚度方向（TC2）为20W / m·K以上的导热率的垂直方向（TC2 / TC1）和与厚度方向垂直的方向（TC2）的导热率的比（TC2 / TC1） 方向（TC1）为3以上。
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公开(公告)号：US20110267557A1
公开(公告)日：2011-11-03
申请号：US13017442
申请日：2011-01-31
IPC分类号： G02F1/13357 , F21V7/22
CPC分类号： G02F1/1336 , G02F2001/133628
摘要： A back light includes an irradiating portion for applying light to a liquid crystal panel and a heat diffusing member which is in contact with the irradiating portion. The heat diffusing member is made of a thermal conductive sheet containing a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
摘要翻译： 背光包括用于向液晶面板施加光的照射部和与照射部接触的散热构件。 散热构件由含有板状氮化硼颗粒的导热片形成，并且与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。
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公开(公告)号：US20110259566A1
公开(公告)日：2011-10-27
申请号：US13016507
申请日：2011-01-28
IPC分类号： F28F7/00
CPC分类号： C09K5/14
摘要： A thermal conductive sheet contains a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more. The thermal conductive sheet does not fall off from an adherend in the initial adhesion test (1) below:Initial adhesion test (1):The thermal conductive sheet is temporarily fixed on an adherend along the horizontal direction, and thereafter the adherend is turned over to be upside down. The maximum cutting resistance on the cutting blade at the time of cutting the thermal conductive sheet is 120 N/30 mm or less.
摘要翻译： 导热片包含板状氮化硼颗粒。 导热片的导热性在与导热片的厚度方向垂直的方向上为4W / m·K以上。 初次粘合试验（1）中，导热片不从被粘物脱落。初次粘合试验（1）：导热片沿水平方向临时固定在被粘物上，然后将被粘物翻转 被颠倒 在切割导热片时切割刀片上的最大切割阻力为120N / 30mm以下。
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公开(公告)号：US20110127461A1
公开(公告)日：2011-06-02
申请号：US12737644
申请日：2009-10-30
申请人： Takahiro Fukuoka , Seiji Izutani
发明人： Takahiro Fukuoka , Seiji Izutani
IPC分类号： C09K5/00
CPC分类号： C09K5/14 , C08G77/14 , C08K3/20 , H01L23/296 , H01L2924/0002 , H01L2924/00 , C08L83/06
摘要： Disclosed is a thermally conductive composition obtained by a sol-gel method in which a sol containing inorganic particles, an alkoxysilane, and water is prepared, the sol is gelated to prepare a gel, and the gel is thermally cured.
摘要翻译： 公开了通过溶胶 - 凝胶法制备的导热组合物，其中制备含有无机颗粒，烷氧基硅烷和水的溶胶，将胶体凝胶化以制备凝胶，并将凝胶热固化。
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6.发明授权Cover tape for electronic part conveyance and electronic part conveying member 失效电子部件输送用盖带和电子部件输送部件公开(公告)号：US06709702B2
公开(公告)日：2004-03-23
申请号：US09892859
申请日：2001-06-28
申请人： Ichiro Nakano , Hiroki Ichikawa , Seiji Izutani
发明人： Ichiro Nakano , Hiroki Ichikawa , Seiji Izutani
IPC分类号： B32B1508
CPC分类号： B32B27/08 , B32B27/10 , H05K13/0084 , Y10T428/12438 , Y10T428/12549 , Y10T428/12562 , Y10T428/2848 , Y10T428/31587 , Y10T428/31605 , Y10T428/31678 , Y10T428/31692
摘要： A cover tape for the electronic-part conveyance comprises at least four laminated layers of: a substrate; at least one layer of a base coating layer and an intermediate layer, provided on the substrate; an adhesive layer, provided on the at least one layer of the coating layer and the intermediate layer; and a conductive layer formed on at least one of the rear surface of the substrate and the front surface of the adhesive layer by deposition.
摘要翻译： 用于电子部件输送的覆盖带包括至少四个层压层：基板; 至少一层基底涂层和中间层，设置在基底上; 设置在所述涂层和所述中间层的所述至少一层上的粘合剂层; 以及通过沉积形成在基板的后表面和粘合剂层的前表面中的至少一个上的导电层。
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公开(公告)号：US08592844B2
公开(公告)日：2013-11-26
申请号：US13016594
申请日：2011-01-28
IPC分类号： H01L33/64
CPC分类号： H01L33/642 , F21Y2115/10 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
摘要翻译： 发光二极管装置包括发光二极管，用于向发光二极管供电的电源电路部分和用于耗散由发光二极管产生的热量的散热构件。 散热构件由含有板状氮化硼颗粒的导热片构成。 与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。
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公开(公告)号：US20130062046A1
公开(公告)日：2013-03-14
申请号：US13606931
申请日：2012-09-07
申请人： Seiji IZUTANI , Takahiro FUKUOKA , Kunio NAGASAKI , Yusuke SUGINO , Kohei DOI
发明人： Seiji IZUTANI , Takahiro FUKUOKA , Kunio NAGASAKI , Yusuke SUGINO , Kohei DOI
CPC分类号： C08J7/02 , C08F220/06 , C08F2220/1833 , C08J2333/02 , C09D4/00 , C09D7/61 , H01L23/3737 , H01L2924/0002 , Y10T156/10 , H01L2924/00
摘要： A thermal conductive sheet is obtained by preparing a resin layer, laminating a particle-containing monomer mixture layer which contains a monomer to be absorbed in the resin layer and a thermal conductive particle on one side surface of the resin layer, localizing the thermal conductive particle at one side by allowing the monomer to be absorbed in the resin layer, and thereafter, reacting the monomer to be cured.
摘要翻译： 通过制备树脂层，将含有待吸收的单体的含有颗粒的单体混合物层和在树脂层的一个侧表面上的导热颗粒层压的导热片，从而定位导热片， 通过使单体被吸收在树脂层中，然后使待固化的单体反应。
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9.发明申请公开(公告)号：US20110262728A1
公开(公告)日：2011-10-27
申请号：US13016685
申请日：2011-01-28
CPC分类号： H01L33/641 , C08K3/38 , C08K7/00 , C08K2003/382 , C08L23/06 , C08L63/00 , C09J7/22 , C09J2205/106 , H01L2224/48091 , Y10T428/25 , H01L2924/00014
摘要： A thermal conductive sheet contains a plate-like boron nitride particle, has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and has a volume resistivity of 1×1010 Ω·cm or more. The transmittance of light at a wavelength of 500 nm is 10% or less. The surface reflectance R of light at 500 nm is 70% or more relative to the surface reflectance of barium sulfate as 100%. A light-emitting diode mounting substrate includes a substrate for mounting a light-emitting diode; and a thermal conductive light reflection layer being formed on the surface of the substrate and including the above-described thermal conductive sheet. A thermal conductive adhesive sheet includes a thermal conductive layer including the above-described thermal conductive sheet, and an adhesive layer or a pressure-sensitive adhesive layer laminated on at least one side of the thermal conductive layer.
摘要翻译： 热传导片包含板状氮化硼颗粒，在与导热片的厚度方向垂直的方向上的导热率为4W / m·K以上，体积电阻率为1×1010Ω·OHgr ;·cm以上。 波长500nm的光的透射率为10％以下。 500nm处的光的表面反射率R相对于100％的硫酸钡的表面反射率为70％以上。 发光二极管安装基板包括用于安装发光二极管的基板; 以及形成在所述基板的表面上并且包括所述导热片的导热光反射层。 导热性粘合片包括包含上述导热片的导热层和层压在导热层的至少一侧上的粘合层或粘合剂层。
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公开(公告)号：US20130065016A1
公开(公告)日：2013-03-14
申请号：US13607068
申请日：2012-09-07
申请人： Seiji IZUTANI , Takahiro FUKUOKA , Kunio NAGASAKI , Yusuke SUGINO , Kohei DOI
发明人： Seiji IZUTANI , Takahiro FUKUOKA , Kunio NAGASAKI , Yusuke SUGINO , Kohei DOI
CPC分类号： H01L23/3737 , B32B5/16 , B32B5/30 , B32B27/14 , B32B2038/0076 , B32B2260/025 , B32B2305/30 , B32B2307/202 , H01L2924/0002 , H05K7/20481 , Y10T156/1052 , Y10T428/24182 , H01L2924/00
摘要： A thermal conductive sheet is obtained by preparing a resin layer; laminating a particle-containing monomer mixture layer which contains a monomer to be absorbed in the resin layer and a thermal conductive particle on one side surface of the resin layer; localizing the thermal conductive particle at one surface side by allowing the monomer to be absorbed in the resin layer; thereafter, reacting the monomer to be cured so as to fabricate a particle-localized sheet; laminating a plurality of the particle-localized sheets so as to allow one surface to be in contact with the other surface to fabricate a particle-localized sheet laminate; and then, cutting the particle-localized sheet laminate into a sheet shape along a laminating direction of each of the particle-localized sheets.
摘要翻译： 通过制备树脂层获得导热片; 层叠含有要吸收在树脂层中的单体和在树脂层的一个侧表面上的导热颗粒的含有颗粒的单体混合物层; 通过允许单体在树脂层中被吸收来定位一个表面侧的导热颗粒; 然后使要固化的单体反应以制备颗粒局部的片; 层叠多个颗粒定位片，以使一个表面与另一个表面接触以制造颗粒局部的片层压体; 然后沿着每个颗粒定位的片材的层压方向将颗粒局部的片状层压体切割成片状。
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