发明申请
US20130068510A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE CIRCUIT AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME 有权
使用其制造的具有VIAS和精细电路的印刷电路板和印刷电路板的制造方法

  • 专利标题: METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE CIRCUIT AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME
  • 专利标题(中): 使用其制造的具有VIAS和精细电路的印刷电路板和印刷电路板的制造方法
  • 申请号: US13589635
    申请日: 2012-08-20
  • 公开(公告)号: US20130068510A1
    公开(公告)日: 2013-03-21
  • 发明人: Soon Chul KWONSang Min LEE
  • 申请人: Soon Chul KWONSang Min LEE
  • 申请人地址: KR Changwon-si
  • 专利权人: SAMSUNG TECHWIN CO., LTD.
  • 当前专利权人: SAMSUNG TECHWIN CO., LTD.
  • 当前专利权人地址: KR Changwon-si
  • 优先权: KR10-2011-0095269 20110921
  • 主分类号: H01B13/00
  • IPC分类号: H01B13/00 H05K1/05
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE CIRCUIT AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME
摘要:
Provided is a method of manufacturing a circuit which includes: (a) providing a substrate made of a conductive material; (b) etching a first surface of the substrate excluding a region in which at least one via is to be formed; (c) etching a region of the etched first surface of the substrate in which an insulated portion of a first circuit is to be formed; (d) stacking a first insulation layer in spaces formed by the etching performed in operations (b) and (c); and (e) grinding a second surface of the substrate to expose the first insulation layer outward along with the first circuit, thereby forming a circuit board.
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