- 专利标题: MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL
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申请号: US13605363申请日: 2012-09-06
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公开(公告)号: US20130072092A1公开(公告)日: 2013-03-21
- 发明人: Michael F. Lofaro , Mahadevaiyer Krishnan , Michael A. Cobb , Dennis G. Manzer
- 申请人: Michael F. Lofaro , Mahadevaiyer Krishnan , Michael A. Cobb , Dennis G. Manzer
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: B24B1/00
- IPC分类号: B24B1/00
摘要:
An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.
公开/授权文献
- US08591289B2 Multi-spindle chemical mechanical planarization tool 公开/授权日:2013-11-26