Invention Application
US20130078433A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM USING THE SAME, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE, EACH USING THE SAME
有权
化学敏感性或辐射敏感性树脂组合物，使用它们的耐光膜，图案形成方法，电子设备制造方法和电子设备，每个使用它们
- Patent Title: ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM USING THE SAME, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE, EACH USING THE SAME
- Patent Title (中): 化学敏感性或辐射敏感性树脂组合物，使用它们的耐光膜，图案形成方法，电子设备制造方法和电子设备，每个使用它们
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Application No.: US13614797Application Date: 2012-09-13
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Publication No.: US20130078433A1Publication Date: 2013-03-28
- Inventor: Kaoru IWATO , Hidenori TAKAHASHI , Michihiro SHIRAKAWA
- Applicant: Kaoru IWATO , Hidenori TAKAHASHI , Michihiro SHIRAKAWA
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2011-207018 20110922
- Main IPC: G03F7/038
- IPC: G03F7/038 ; B32B3/10 ; G03F7/20
Abstract:
Provided are an actinic-ray-sensitive or a radiation-sensitive resin composition with greater residual film ratio and capable of suppressing pattern collapse and an occurrence of bridge defects after development, and a resist film, a pattern forming method, an electronic device manufacturing method, and an electronic device, each using the same. An actinic-ray-sensitive or radiation-sensitive resin composition includes a resin (P) having a repeating unit (a) represented by following General Formula (I), a compound (B) represented by any of following General Formulae (B-1) to (B-3), and a solvent, in General Formula (I), R0 represents a hydrogen atom or a methyl group, and R1, R2 and R3 each independently represent a straight chain or branched alkyl group.
Public/Granted literature
Information query
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