发明申请
US20130082381A1 STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
有权
使用不带WINDOWS的WIREBOND组件的终端设备的最小化
- 专利标题： STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
- 专利标题（中）： 使用不带WINDOWS的WIREBOND组件的终端设备的最小化
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申请号： US13440212申请日： 2012-04-05
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公开(公告)号： US20130082381A1公开(公告)日： 2013-04-04
- 发明人: Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
- 申请人： Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
- 申请人地址： US CA San Jose
- 专利权人： INVENSAS CORPORATION
- 当前专利权人： INVENSAS CORPORATION
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and second parallel grids of the package. The first terminals of each grid are configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.
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