发明申请
- 专利标题: Antenna Structures with Molded and Coated Substrates
- 专利标题(中): 具有成型和涂层基板的天线结构
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申请号: US13250784申请日: 2011-09-30
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公开(公告)号: US20130082895A1公开(公告)日: 2013-04-04
- 发明人: Boon W. Shiu , Peter Bevelacqua , Jiang Zhu , Jerzy Guterman , Robert W. Schlub , Ruben Caballero
- 申请人: Boon W. Shiu , Peter Bevelacqua , Jiang Zhu , Jerzy Guterman , Robert W. Schlub , Ruben Caballero
- 主分类号: H01Q1/38
- IPC分类号: H01Q1/38 ; B05D5/12 ; C25D5/02 ; H01Q7/00
摘要:
Electronic devices may be provided with antenna structures. The antenna structures may be used in wirelessly transmitting and receiving radio-frequency signals. Antenna structures may be formed from molded dielectric substrates. Patterned conductive material may be formed on the dielectric substrates. The dielectric substrates may be formed from molded materials such as glass or ceramic. Sheets of dielectric or dielectric powder may be compressed to form a dielectric substrate of a desired shape. The patterned conductive material may be formed from metallic paint or other conductors. A hollow antenna chamber may be formed by joining molded dielectric structures. An antenna such as an indirectly-fed loop antenna or other antennas may be formed from the molded dielectric substrates and patterned conductors.
公开/授权文献
- US09937526B2 Antenna structures with molded and coated substrates 公开/授权日:2018-04-10
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