发明申请
- 专利标题： APPARATUSES AND METHODS FOR TREATING SUBSTRATE
- 专利标题（中）： 用于处理基板的装置和方法
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申请号： US13606628申请日： 2012-09-07
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公开(公告)号： US20130084404A1公开(公告)日： 2013-04-04
- 发明人: Chul Ho PARK
- 申请人： Chul Ho PARK
- 申请人地址： KR Cheonan-si
- 专利权人： SEMES CO., LTD.
- 当前专利权人： SEMES CO., LTD.
- 当前专利权人地址： KR Cheonan-si
- 优先权： KR10-2011-0099835 20110930; KR10-2011-0143128 20111227
- 主分类号： B05D1/26
- IPC分类号： B05D1/26 ; B05D3/06 ; B05C5/02
摘要：
Provided is an apparatus and method for treating a substrate, and more particularly, an apparatus and method for treating a substrate which performs a patterning process. The substrate treating apparatus includes a stage on which a substrate is placed, a discharge unit that discharges ink to form lines on the substrate placed on the stage, a solidifying unit that solidifies the discharged ink, and a transfer unit moving the stage or moving the discharge unit and the solidifying unit.
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