公开(公告)号：US12125717B2

公开(公告)日：2024-10-22

申请号：US17533348

申请日：2021-11-23

申请人： SEMES CO., LTD.

发明人： Ki Sang Eum ,  Jin Ho Choi ,  Byoung Doo Choi ,  Seung Han Lee ,  Sun Wook Jung ,  Si Eun Kim

IPC分类号： H01L21/67 ,  C23C16/44 ,  C23C16/455 ,  H01L21/02 ,  H01L21/687

CPC分类号： H01L21/67051 ,  C23C16/4412 ,  C23C16/45502 ,  H01L21/68764 ,  H01L21/02337

摘要： An apparatus for treating a substrate, the apparatus comprising: a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit supplying treating liquid to the substrate supported by the support unit; and an exhaust unit exhausting an air flow in the inner space, wherein the processing container includes a bottom wall and a side wall extending from the outside end of the bottom wall, the processing container including a first gas-liquid separator provided at the side wall.

公开(公告)号：US12125678B2

公开(公告)日：2024-10-22

申请号：US16880221

申请日：2020-05-21

申请人： SEMES CO., LTD.

发明人： Ogsen Galstyan ,  Hyo Seong Seong ,  Byeung Geon Jeon ,  Jong Hwan An

IPC分类号： H01J3/32 ,  H01J37/32 ,  H01L21/683 ,  H03H7/01 ,  H01L21/67

CPC分类号： H01J37/32174 ,  H01J37/32724 ,  H01L21/6833 ,  H03H7/0115 ,  H03H7/0153 ,  H01J2237/334 ,  H01L21/67069

摘要： A substrate treating apparatus is disclosed. The substrate treating apparatus may include a chamber having a treating space defined therein, a support unit for supporting the substrate in the treating space, a heater power source for applying electric power to a heater in the support unit, a high-frequency power source for applying high-frequency power to a lower electrode in the support unit, and a filter unit installed at a line for connecting the heater power source with the heater to prevent high-frequency inflow. The filter unit may include a housing, one or more coils in the housing, and an adjustment member disposed between the housing and the coil. The adjustment member may be made of a non-magnetic material. The adjustment member may be spaced from the coil at a predefined spacing, and spaced apart from an inner wall of the housing or in contact with the housing inner wall.

公开(公告)号：US12124169B2

公开(公告)日：2024-10-22

申请号：US17566395

申请日：2021-12-30

申请人： SEMES CO., LTD.

发明人： Sang Eun Noh ,  Ki Sang Eum ,  Chang Suk Oh

IPC分类号： G03F7/16 ,  B05C5/02

CPC分类号： G03F7/16 ,  B05C5/02

摘要： Provided is an apparatus for treating a substrate. In the exemplary embodiment, the apparatus for treating the substrate includes a cup configured to have a treating space with an opened upper portion; a support unit configured to support the substrate in the treating space; a liquid supply unit configured to have a treating liquid supply nozzle for supplying a treating liquid to the substrate supported by the support unit; and a nozzle standby port which is positioned outside treating space, provides a standby space in which the nozzle stands by before and after treating the substrate in the treating space, and has a cleaning member for cleaning the nozzle positioned in the standby space, wherein the nozzle standby port includes an insertion hole provided so that a nozzle tip of the treating liquid supply nozzle is insertable; and a spray member configured to spray a cleaning liquid to the nozzle tip inserted into the insertion hole, wherein an impact point of the cleaning liquid may be spaced apart from the center of the nozzle tip at a predetermined distance.

公开(公告)号：US20240339299A1

公开(公告)日：2024-10-10

申请号：US18607486

申请日：2024-03-17

申请人： SEMES CO., LTD.

发明人： Yoon Seok CHOI ,  Sun Wook JUNG ,  Youn Gun BONG

IPC分类号： H01J37/32

CPC分类号： H01J37/3222 ,  H01J37/32229 ,  H01J37/32238 ,  H01J37/3244 ,  H01J37/32541 ,  H01J37/3255

摘要： Proposed are a microwave antenna, and a power supplying device and a substrate processing apparatus including the same, which ensure efficient placement of components while effectively applying power to a plasma chamber. The microwave antenna includes a ring frame, and a plurality of slots provided on an inner wall of the ring frame.

公开(公告)号：US12094692B2

公开(公告)日：2024-09-17

申请号：US17455501

申请日：2021-11-18

申请人： Semes Co., Ltd.

发明人： Jinhyeok Kim ,  Dongmok Lee ,  Yeonghun Wi ,  Yonghyun Ham ,  Yeonggyo Jeong

IPC分类号： H01J37/32

CPC分类号： H01J37/32642 ,  H01J2237/334

摘要： An apparatus for processing a substrate may include a processing module including at least one process chamber for performing a desired process on a substrate and an index module transferring the substrate into the processing module from an outside. The at least one process chamber may include a housing providing a process space therein, a supporting unit disposed in the housing to support a substrate, the supporting unit including a focus ring having a plurality of rings, a gas supply unit providing a process gas into the process space, and a plasma generating unit generating a plasma from the process gas in the process space. The focus ring may include a stepped structure having a plurality of stepped portions downwardly provided toward the substrate.

公开(公告)号：US12090754B2

公开(公告)日：2024-09-17

申请号：US17870835

申请日：2022-07-22

申请人： SEMES CO., LTD.

发明人： Sang Uk Son ,  Yong Tak Hyun ,  Dae Sung Kim

IPC分类号： B41J2/045

CPC分类号： B41J2/0451 ,  B41J2/04586

摘要： Provided are a nozzle inspection method and a nozzle inspection apparatus capable of accurately detecting a defect in an inkjet head nozzle within a short time. The nozzle inspection method comprises discharging a plurality of droplets into a first region of interest of a substrate using a first nozzle to form an inspection pattern, and determining whether the first nozzle is defective based on the inspection pattern.

公开(公告)号：US12083551B2

公开(公告)日：2024-09-10

申请号：US17884709

申请日：2022-08-10

申请人： SEMES CO., LTD.

发明人： Sang Min Lee ,  Woo Jin Chung ,  Ki Bong Kim

IPC分类号： B05C11/10 ,  B05C5/02 ,  H01L21/67

CPC分类号： B05C5/0225 ,  B05C11/1002 ,  B05C11/1031

摘要： The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

公开(公告)号：US20240270511A1

公开(公告)日：2024-08-15

申请号：US18399392

申请日：2023-12-28

申请人： SEMES CO., LTD.

发明人： Da Han KIM ,  Seung Chan LEE ,  Ho Young LEE

IPC分类号： B65G47/90

CPC分类号： B65G47/90

摘要： A gripper gripping a plurality of types of probe cards is provided. The gripper includes a frame, a driving unit connected to the frame, and a plurality of gripper portions connected to the driving unit and including an inner gripper portion and an outer gripper portion. The gripper portions include a moving block moving in a radial direction as the driving unit is driven, and the inner gripper portion and the outer gripper portion connected to the moving block. The outer gripper portion is rotatably connected to the moving block, and is configured such that the outer gripper portion rotates downward with respect to the moving block as the moving block moves in a radial outward direction.

公开(公告)号：US12057335B2

公开(公告)日：2024-08-06

申请号：US17957428

申请日：2022-09-30

申请人： SEMES CO., LTD.

发明人： Sang Min Lee ,  Jin Se Park ,  Ki Hoon Choi

IPC分类号： G01N1/10 ,  G01N1/20 ,  H01L21/67 ,  H01L21/66

CPC分类号： H01L21/67253 ,  G01N1/10 ,  H01L21/67034

摘要： Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.

公开(公告)号：US12051565B2

公开(公告)日：2024-07-30

申请号：US17527128

申请日：2021-11-15

申请人： SEMES CO., LTD.

发明人： Young Kuk Kim ,  Tae Hoon Jo ,  Goon Ho Park ,  Ja Myung Gu

IPC分类号： H01J37/32

CPC分类号： H01J37/32183 ,  H01J37/3244

摘要： Disclosed is an apparatus for treating a substrate. The apparatus includes: an RF power supply; a process chamber which performs plasma processing by using power applied from the RF power supply; and an impedance matching unit which is disposed between the RF power supply and the process chamber and performs matching, in which the RF power supply includes a first sensor measuring impedance in a direction of the process chamber and the impedance matching unit, and the impedance matching unit performs impedance matching by reflecting impedance measured in the RF power supply through the first sensor.