发明申请
- 专利标题： RADIATION-SHIELDED SEMICONDUCTOR DEVICE
- 专利标题（中）： 辐射屏蔽半导体器件
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申请号： US13253344申请日： 2011-10-05
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公开(公告)号： US20130087895A1公开(公告)日： 2013-04-11
- 发明人: Suresh Kumar Upadhyayula , Hem Takiar , Chih-Chin Liao
- 申请人： Suresh Kumar Upadhyayula , Hem Takiar , Chih-Chin Liao
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/56 ; H01L21/58
摘要：
A semiconductor device is disclosed including an electromagnetic radiation shield. The device may include a substrate having a shield ring defined in a conductance pattern on a surface of the substrate. One or more semiconductor die may be affixed and electrically coupled to the substrate. The one or more semiconductor die may then be encapsulated in molding compound. Thereafter, a metal may be plated around the molding compound and onto the shield ring to form an EMI/RFI shield for the device.
公开/授权文献
- US08637963B2 Radiation-shielded semiconductor device 公开/授权日：2014-01-28
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