Invention Application
- Patent Title: SUPPORT STRUCTURE FOR TELECOMMUNICATION JACKS
- Patent Title (中): 电信插座支持结构
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Application No.: US13704352Application Date: 2011-05-25
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Publication No.: US20130090005A1Publication Date: 2013-04-11
- Inventor: Mathieu Nesme , Guy Metral
- Applicant: Mathieu Nesme , Guy Metral
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Priority: EP10166785.5 20100622
- International Application: PCT/US2011/037893 WO 20110525
- Main IPC: H04Q1/14
- IPC: H04Q1/14 ; H01R43/01
Abstract:
In the field of telecommunication and data transmission, a jack support structure for fixing a plurality of modular telecommunications jacks on a patch panel. The jack support structure has at least two parallel rows of jack cavities, and fixing means for fixing the jack support structure on a patch panel, characterized by the fixing means being positioned only between two adjacent rows.
Public/Granted literature
- US08758048B2 Support structure for telecommunication jacks Public/Granted day:2014-06-24
Information query
