The disclosure provides a motherboard module, which includes a motherboard, a cover, a plurality of raised posts and a plurality of plates. The cover covers the motherboard thereon and a first space is formed by the cover and the motherboard. The raised posts are disposed in the first space. The plates are detachably assembled to the raised posts and connected between any two adjacent raised posts so as to partition the first space into a plurality of second spaces. The plates and the raised posts can restrict the heat generated by the heat sources at different limited areas, which is advantageous for the cooling air-flow to cool the heat sources and the motherboard module thereby has better cooling performance.