发明申请
- 专利标题： MANUFACTURING METHOD OF PACKAGE STRUCTURE
- 专利标题（中）： 包装结构的制造方法
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申请号： US13692971申请日： 2012-12-03
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公开(公告)号： US20130095615A1公开(公告)日： 2013-04-18
- 发明人: Shih-Hao Sun , Chang-Fu Chen
- 申请人： Shih-Hao Sun , Chang-Fu Chen
- 优先权： TW100115473 20110503
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.
公开/授权文献
- US08893379B2 Manufacturing method of package structure 公开/授权日：2014-11-25
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