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    Manufacturing method of package carrier
    5.
    发明授权
    Manufacturing method of package carrier 有权
    包装载体的制造方法

    公开(公告)号：US09204560B2

    公开(公告)日：2015-12-01

    申请号：US14547147

    申请日：2014-11-19

    申请人： Shih-Hao Sun

    发明人： Shih-Hao Sun

    IPC分类号： H05K3/12 ,  H05K3/42 ,  H01L23/498 ,  H01L21/48 ,  H01L21/447 ,  H01L33/64

    CPC分类号： H05K3/42 ,  H01L21/447 ,  H01L21/486 ,  H01L23/49827 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  Y10T29/49165 ,  H01L2224/0401

    摘要： A manufacturing method of a package carrier is provided. An insulation substrate having an upper surface, a lower surface, plural cavities located at the lower surface and plural through holes passing through the insulation substrate and respectively communicating with the cavities is provided. Plural vias is defined by the cavities and the through holes. A conductive material filling up the vias is formed to define plural conductive posts. An insulation layer having a top surface and plural blind vias extending from the top surface to the conductive posts is formed on the upper surface. A patterned circuit layer filling up the blind vias, being connected to the conductive posts and exposing a portion of the top surface is formed on the top surface. A solder mask layer is formed on the patterned circuit layer and has plural openings exposing a portion of the patterned circuit layer to define plural pads.

    摘要翻译： 提供了一种封装载体的制造方法。 提供了具有上表面，下表面，位于下表面的多个空腔和穿过绝缘基板并分别与空腔连通的多个通孔的绝缘基板。 多个通孔由腔和通孔限定。 填充通孔的导电材料形成为限定多个导电柱。 在上表面上形成有从上表面延伸到导电柱的顶表面和多个盲孔的绝缘层。 填充盲孔的图案化电路层形成在顶表面上，连接到导电柱并暴露顶表面的一部分。 在图案化电路层上形成焊料掩模层，并且具有暴露图案化电路层的一部分以限定多个焊盘的多个开口。

    Package carrier and manufacturing method thereof
    6.
    发明授权
    Package carrier and manufacturing method thereof 有权
    包装载体及其制造方法

    公开(公告)号：US08704101B2

    公开(公告)日：2014-04-22

    申请号：US13539505

    申请日：2012-07-02

    申请人： Shih-Hao Sun

    发明人： Shih-Hao Sun

    IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K1/18

    CPC分类号： H01L23/3677 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5389 ,  H01L25/16 ,  H01L25/167 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09581 ,  H05K2201/10416 ,  H05K2203/1469 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface, and an opening communicating the two surfaces is provided. An electronic device is disposed inside the opening. A first insulation layer and a superimposed first metal layer are laminated on the upper surface; a second insulation layer and a superimposed second metal layer are laminated on the lower surface. The opening is filled with the first and second insulation layers. First blind holes, second blind holes, and a heat-dissipation channel are formed. A third metal layer is formed on the first and second blind holes and an inner wall of the heat-dissipation channel. A heat-conducting device is disposed inside the heat-dissipation channel and fixed into the heat-dissipation channel via an insulation material. The first and second metal layers are patterned to form a first patterned metal layer and a second patterned metal layer.

    摘要翻译： 在包装载体的制造方法中，提供具有上表面，下表面和连通两个表面的开口的基板。 电子设备设置在开口内。 第一绝缘层和叠置的第一金属层层叠在上表面上; 第二绝缘层和叠加的第二金属层层叠在下表面上。 开口填充有第一和第二绝缘层。 形成第一盲孔，第二盲孔和散热通道。 在第一和第二盲孔和散热通道的内壁上形成第三金属层。 导热装置设置在散热通道的内部并通过绝缘材料固定到散热通道中。 图案化第一和第二金属层以形成第一图案化金属层和第二图案化金属层。

    METHOD OF MANUFACTURING PACKAGE STRUCTURE
    7.
    发明申请
    METHOD OF MANUFACTURING PACKAGE STRUCTURE 有权
    制造包装结构的方法

    公开(公告)号：US20130260512A1

    公开(公告)日：2013-10-03

    申请号：US13906355

    申请日：2013-05-31

    申请人： Shih-Hao Sun

    发明人： Shih-Hao Sun

    IPC分类号： H01L21/56

    CPC分类号： H01L21/56 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A manufacturing method of a package structure is provided. A seed layer is formed on a upper surface of a metal substrate. A patterned dry film layer is formed on a lower surface of the metal substrate and the seed layer. A portion of the seed layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a circuit layer on the portion of the seed layer exposed by the patterned dry film layer. A chip is bonded to and electrically connected to the circuit layer. A molding compound is formed on the metal substrate. The molding compound encapsulates the chip, the circuit layer and the portion of the seed layer. A portion of the metal substrate and a portion of the seed layer are removed so as to expose a portion of the molding compound.

    摘要翻译： 提供一种封装结构的制造方法。 种子层形成在金属基板的上表面上。 在金属基板的下表面和种子层上形成图案化的干膜层。 种子层的一部分被图案化的干膜层曝光。 图案化的干膜层用作电镀掩模，以在由图案化的干膜层暴露的种子层的部分上电镀电路层。 芯片被接合并电连接到电路层。 在金属基材上形成模塑料。 模塑料封装芯片，电路层和种子层的部分。 去除金属基材的一部分和种子层的一部分，以暴露部分模塑料。

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
    包装结构及其制造方法

    公开(公告)号：US20120293977A1

    公开(公告)日：2012-11-22

    申请号：US13288972

    申请日：2011-11-04

    申请人： Shih-Hao Sun

    发明人： Shih-Hao Sun

    IPC分类号： H05K7/00 ,  H05K13/00

    CPC分类号： H05K13/00 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/12041 ,  H01L2924/15788 ,  H05K1/0207 ,  H05K1/185 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49146 ,  H01L2924/00

    摘要： A manufacturing method of a package structure is provided. A substrate having an upper surface and a lower surface opposite to each other and an opening communicating the surfaces is provided. An electronic device is configured in the opening. An adhesive layer and a patterned metal layer located on the adhesive layer are laminated on the lower surface and expose a bottom surface of the electronic device. A heat-dissipating column is formed on the bottom surface exposed by the adhesive layer and the patterned metal layer and connects the patterned metal layer and the bottom surface. A first and a second laminated structures are laminated on the upper surface of the substrate and the patterned metal layer, respectively. The first laminated structure covers the upper surface of the substrate and a top surface of the electronic device. The second laminated structure covers the heat-dissipating column and the patterned metal layer.

    摘要翻译： 提供一种封装结构的制造方法。 提供具有彼此相对的上表面和下表面的基板以及连通表面的开口。 电子设备配置在开口中。 位于粘合剂层上的粘合剂层和图案化的金属层层压在下表面上并暴露电子器件的底表面。 在由粘合层和图案化金属层露出的底面上形成散热柱，并连接图案化的金属层和底面。 第一和第二层压结构分别层叠在基板的上表面和图案化的金属层上。 第一层压结构覆盖基板的上表面和电子设备的顶表面。 第二层压结构覆盖散热柱和图案化的金属层。

    Method of manufacturing a package carrier
    9.
    发明授权
    Method of manufacturing a package carrier 有权
    制造包装载体的方法

    公开(公告)号：US09153521B2

    公开(公告)日：2015-10-06

    申请号：US13162549

    申请日：2011-06-16

    申请人： Shih-Hao Sun

    发明人： Shih-Hao Sun

    IPC分类号： H01L23/427 ,  H01C17/02 ,  H01L23/367 ,  H01L23/13 ,  H01L23/498 ,  H01L33/48

    CPC分类号： H01L23/427 ,  H01C17/02 ,  H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0075 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/49126 ,  Y10T29/49353 ,  H01L2924/00014

    摘要： A method of manufacturing a package carrier is provided. An insulation cover is provided. The insulation cover has an inner surface and an outer surface opposite to each other, a plurality of openings, and a containing space. A patterned metal layer is formed on the outer surface of the insulation cover. A surface treatment layer is formed on the patterned metal layer. A heat dissipation element is formed in the containing space of the insulation cover and structurally connected to the insulation cover. A thermal-conductive layer is formed on a surface of the heat dissipation element, and a portion of the thermal-conductive layer is exposed by the openings of the insulation cover.

    摘要翻译： 提供一种制造封装载体的方法。 提供绝缘盖。 绝缘盖具有彼此相对的内表面和外表面，多个开口和容纳空间。 在绝缘盖的外表面上形成图案化的金属层。 在图案化金属层上形成表面处理层。 散热元件形成在绝缘盖的容纳空间中并且结构地连接到绝缘盖。 在散热元件的表面上形成导热层，并且导热层的一部分被绝缘盖的开口露出。