Invention Application
US20130096249A1 NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAINING THE ORGANOSILICON COMPOUND, HARDENING RESIN AND ENCAPSULATION MATERIAL FOR OPTICAL SEMICONDUCTOR
有权
新有机硅化合物，含有机硅氧烷化合物的热固性树脂组合物，光学半导体的硬化树脂和封装材料
- Patent Title: NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAINING THE ORGANOSILICON COMPOUND, HARDENING RESIN AND ENCAPSULATION MATERIAL FOR OPTICAL SEMICONDUCTOR
- Patent Title (中): 新有机硅化合物，含有机硅氧烷化合物的热固性树脂组合物，光学半导体的硬化树脂和封装材料
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Application No.: US13698279Application Date: 2011-05-18
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Publication No.: US20130096249A1Publication Date: 2013-04-18
- Inventor: Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
- Applicant: Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
- Applicant Address: JP TOKYO
- Assignee: JNC CORPORATION
- Current Assignee: JNC CORPORATION
- Current Assignee Address: JP TOKYO
- Priority: JP2010-114049 20100518
- International Application: PCT/JP2011/061359 WO 20110518
- Main IPC: C08F30/08
- IPC: C08F30/08 ; C09D183/04 ; C07F7/21
Abstract:
A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0≦a≦3.5, 0≦b≦3.5, and 0≦c≦1 are obtained, and also a+b+2c=4 is obtained:
Public/Granted literature
Information query
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