发明申请
US20130099371A1 SEMICONDUCTOR PACKAGE HAVING SOLDER JOINTED REGION WITH CONTROLLED AG CONTENT
审中-公开
具有受控AG内容的焊接接头区域的半导体封装
- 专利标题： SEMICONDUCTOR PACKAGE HAVING SOLDER JOINTED REGION WITH CONTROLLED AG CONTENT
- 专利标题（中）： 具有受控AG内容的焊接接头区域的半导体封装
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申请号： US13278621申请日： 2011-10-21
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公开(公告)号： US20130099371A1公开(公告)日： 2013-04-25
- 发明人: Ming-Da CHENG , Kuei-Wei HUANG , Yu-Peng TSAI , Cheng-Ting CHEN , Hsiu-Jen LIN , Chung-Shi LIU
- 申请人： Ming-Da CHENG , Kuei-Wei HUANG , Yu-Peng TSAI , Cheng-Ting CHEN , Hsiu-Jen LIN , Chung-Shi LIU
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The silver (Ag) content in the solder layer is between 0.5 and 1.8 weight percent.
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