公开(公告)号：US20130099371A1

公开(公告)日：2013-04-25

申请号：US13278621

申请日：2011-10-21

申请人： Ming-Da CHENG ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Cheng-Ting CHEN ,  Hsiu-Jen LIN ,  Chung-Shi LIU

发明人： Ming-Da CHENG ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Cheng-Ting CHEN ,  Hsiu-Jen LIN ,  Chung-Shi LIU

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/01029 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01073 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/01025 ,  H01L2924/01022 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The silver (Ag) content in the solder layer is between 0.5 and 1.8 weight percent.

摘要翻译： 半导体封装包括具有导电迹线的工件和具有导电柱的芯片。 芯片附着在工件上，并且在导电柱和导电迹线之间形成焊点区域。 焊料层中的银（Ag）含量为0.5-1.8重量％。

公开(公告)号：US20130099370A1

公开(公告)日：2013-04-25

申请号：US13277575

申请日：2011-10-20

申请人： Ming-Da CHENG ,  Chih-Wei LIN ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Chun-Cheng LIN ,  Chung-Shi LIU

发明人： Ming-Da CHENG ,  Chih-Wei LIN ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Chun-Cheng LIN ,  Chung-Shi LIU

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/16 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/1601 ,  H01L2224/16104 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 μm.

摘要翻译： 半导体封装包括具有导电迹线的工件和具有导电柱的芯片。 芯片附着在工件上，并且在导电柱和导电迹线之间形成焊点区域。 导电柱和导电迹线之间的距离小于或等于约16μm。