发明申请
- 专利标题: Process for Forming Packages
- 专利标题(中): 形成包的过程
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申请号: US13280163申请日: 2011-10-24
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公开(公告)号: US20130102112A1公开(公告)日: 2013-04-25
- 发明人: Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
- 申请人: Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L21/52
- IPC分类号: H01L21/52 ; B23K37/04 ; B23K5/22
摘要:
A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat.
公开/授权文献
- US08603860B2 Process for forming packages 公开/授权日:2013-12-10
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