发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US13646074申请日： 2012-10-05
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公开(公告)号： US20130105985A1公开(公告)日： 2013-05-02
- 发明人: Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
- 申请人： Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
- 优先权： JP2011-240560 20111101
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device includes a connection terminal. The connection terminal includes two legs bonded via a filler material to a bonding target object that is a substrate or one semiconductor element placed on the substrate; and a joining portion connected to the two legs, extending between the two legs, and separated from the bonding target object.
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IPC分类:
