公开(公告)号：US20130105985A1

公开(公告)日：2013-05-02

申请号：US13646074

申请日：2012-10-05

申请人： Junji TSURUOKA ,  Seiji YASUI ,  Osamu YAMATO ,  Takayuki MAEDA

发明人： Junji TSURUOKA ,  Seiji YASUI ,  Osamu YAMATO ,  Takayuki MAEDA

IPC分类号： H01L23/48

CPC分类号： B23K1/0016 ,  H01L23/36 ,  H01L23/492 ,  H01L24/37 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40101 ,  H01L2224/40139 ,  H01L2224/40151 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/37099

摘要： A semiconductor device includes a connection terminal. The connection terminal includes two legs bonded via a filler material to a bonding target object that is a substrate or one semiconductor element placed on the substrate; and a joining portion connected to the two legs, extending between the two legs, and separated from the bonding target object.

摘要翻译： 半导体器件包括连接端子。 连接端子包括通过填充材料连接到作为衬底的结合目标物体的两个腿或放置在衬底上的一个半导体元件; 以及连接到两个腿的连接部分，在两个腿之间延伸并且与结合目标物体分离。

公开(公告)号：US20130113120A1

公开(公告)日：2013-05-09

申请号：US13646151

申请日：2012-10-05

申请人： Junji TSURUOKA ,  Seiji YASUI ,  Osamu YAMATO ,  Takayuki MAEDA

发明人： Junji TSURUOKA ,  Seiji YASUI ,  Osamu YAMATO ,  Takayuki MAEDA

IPC分类号： H01L23/52 ,  H01L21/58

CPC分类号： H01L24/40 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/36 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor device includes a metal substrate; a semiconductor element placed on the metal substrate; a flexible circuit substrate that has one end placed on the metal substrate and is electrically connected to the semiconductor element, the flexible circuit substrate extending over an edge of the metal substrate to outside the metal substrate; a resin wall portion placed, in an outer periphery of the metal substrate, at least at the edge of the metal substrate over which the flexible circuit substrate extends, the resin wall portion being provided on the flexible circuit substrate at the edge; and a resin seal portion provided inside the resin wall portion so as to cover the metal substrate.

摘要翻译： 半导体器件包括金属基板; 放置在金属基板上的半导体元件; 柔性电路基板，其一端放置在所述金属基板上，并且电连接到所述半导体元件，所述柔性电路基板在所述金属基板的边缘上延伸到所述金属基板的外部; 在所述金属基板的外周至少在所述柔性电路基板所延伸的所述金属基板的边缘处设置树脂壁部，所述树脂壁部设置在所述柔性电路基板的所述边缘处; 以及设置在树脂壁部内部以覆盖金属基板的树脂密封部。