发明申请
- 专利标题： HEAT TREATMENT APPARATUS
- 专利标题（中）： 热处理设备
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申请号： US13354358申请日： 2012-01-20
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公开(公告)号： US20130112669A1公开(公告)日： 2013-05-09
- 发明人: Takashi UEMURA , Kenetsu Yokogawa , Masatoshi Miyake , Masaru Izawa , Satoshi Sakai
- 申请人： Takashi UEMURA , Kenetsu Yokogawa , Masatoshi Miyake , Masaru Izawa , Satoshi Sakai
- 优先权： JP2011-244083 20111108
- 主分类号： B23K9/00
- IPC分类号： B23K9/00
摘要：
The present invention provides a heat treatment apparatus which can reduce a surface roughing of a processed substrate while keeping a heat efficiency high, even in the case of heating a sample to be heated to 1200° C. or higher. The present invention is a heat treatment apparatus carrying out a heat treatment of a sample to be heated, wherein a plasma generated by a glow electric discharge is used as a heating source, and the sample to be heated is indirectly heated.