发明申请
US20130115721A1 EPITAXIAL FILM GROWTH IN RETROGRADE WELLS FOR SEMICONDUCTOR DEVICES
有权
用于半导体器件的退火电极中的外延膜生长
- 专利标题: EPITAXIAL FILM GROWTH IN RETROGRADE WELLS FOR SEMICONDUCTOR DEVICES
- 专利标题(中): 用于半导体器件的退火电极中的外延膜生长
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申请号: US13487878申请日: 2012-06-04
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公开(公告)号: US20130115721A1公开(公告)日: 2013-05-09
- 发明人: Robert D. Clark
- 申请人: Robert D. Clark
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238 ; H01L21/66
摘要:
A method of fabricating a semiconductor device. A substrate is provided and includes a dielectric layer and a mask layer, which is patterned and developed. A plurality of trenches is created within the dielectric material by a retrograde etching process. The plurality of trenches is subsequently overfilled with a material by heteroepitaxial growth with aspect ratio trapping. The material includes at least one of germanium, a Group III-V compound, or a combination of two or more thereof. The overfilled plurality of trenches is then planarized.