Invention Application
- Patent Title: WOUND TREATMENT APPARATUS EMPLOYING REDUCED PRESSURE
- Patent Title (中): 使用减压压力的治疗设备
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Application No.: US13728595Application Date: 2012-12-27
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Publication No.: US20130116660A1Publication Date: 2013-05-09
- Inventor: Keith Patrick Heaton , Kenneth William Hunt
- Applicant: KCI Licensing, Inc.
- Applicant Address: US TX San Antonio
- Assignee: KCI Licensing, Inc.
- Current Assignee: KCI Licensing, Inc.
- Current Assignee Address: US TX San Antonio
- Priority: GB9909301.5 19990422
- Main IPC: A61M27/00
- IPC: A61M27/00

Abstract:
An apparatus for stimulating healing of a wound, includes a porous pad adapted to contact a surface of the wound on an affected part of a body. An envelope for receiving the porous pad and the affected part of the body is provided, and the envelope includes a re-sealable opening that permits the wound to be inspected. A connector is fluidly connected to an interior of the envelope and to a source of negative pressure.
Public/Granted literature
- US08779229B2 Wound treatment apparatus employing reduced pressure Public/Granted day:2014-07-15
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