发明申请
US20130118787A1 EPOXY RESIN COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD
审中-公开
用于形成印刷电路板的环氧树脂组合物，其制造的印刷电路板以及制造印刷电路板的方法
- 专利标题： EPOXY RESIN COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD
- 专利标题（中）： 用于形成印刷电路板的环氧树脂组合物，其制造的印刷电路板以及制造印刷电路板的方法
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申请号： US13362406申请日： 2012-01-31
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公开(公告)号： US20130118787A1公开(公告)日： 2013-05-16
- 发明人: Tae Hoon Kim , Young Kwan Seo , Jun Young Kim , Sung Nam Cho
- 申请人： Tae Hoon Kim , Young Kwan Seo , Jun Young Kim , Sung Nam Cho
- 申请人地址： KR Gyunggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-do
- 优先权： KR1020110118898 20111115
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; C08J9/28 ; C08L63/04
摘要：
Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit board can be formed in an ecofriendly and economic manner. Further, high-reliability microcircuits can be realized by enhancing interface adhesive strength between a resin substrate and a metal layer in a buildup type printed circuit board.
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