发明申请
- 专利标题： Package Structures and Methods for Forming the Same
- 专利标题（中）： 包装结构及其形成方法
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申请号： US13298102申请日： 2011-11-16
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公开(公告)号： US20130119539A1公开(公告)日： 2013-05-16
- 发明人: Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
- 申请人： Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H01L21/60 ; H01L23/485
摘要：
A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A solder region is disposed in the polymer region and electrically coupled to the redistribution line. The solder region includes a second flat top surface not higher than the first flat top surface.
公开/授权文献
- US09679836B2 Package structures and methods for forming the same 公开/授权日：2017-06-13