发明申请
US20130126959A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
半导体器件及制造半导体器件的方法
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件及制造半导体器件的方法
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申请号： US13613473申请日： 2012-09-13
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公开(公告)号： US20130126959A1公开(公告)日： 2013-05-23
- 发明人: Ryota Aburada , Takashi Obara , Toshiya Kotani
- 申请人： Ryota Aburada , Takashi Obara , Toshiya Kotani
- 优先权： JP2011-254854 20111122
- 主分类号： H01L27/088
- IPC分类号： H01L27/088 ; H01L21/302 ; H01L21/336 ; H01L29/02
摘要：
According to one embodiment, there are provided a first shaped pattern in which a plurality of first holes are arranged and of which a width is periodically changed along an arrangement direction of the first holes, a second shaped pattern in which a plurality of second holes are arranged and of which a width is periodically changed along an arrangement direction of the second holes, and slits which are formed along the arrangement direction of the first holes and separate the first shaped pattern and the second shaped pattern.
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