发明申请
US20130140442A1 AMPLIFYING CIRCUIT AND MANUFACTURING METHOD, SOLID-STATE IMAGING ELEMENT, AND ELECTRONIC DEVICE
审中-公开
放大电路和制造方法，固态成像元件和电子器件
- 专利标题： AMPLIFYING CIRCUIT AND MANUFACTURING METHOD, SOLID-STATE IMAGING ELEMENT, AND ELECTRONIC DEVICE
- 专利标题（中）： 放大电路和制造方法，固态成像元件和电子器件
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申请号： US13671167申请日： 2012-11-07
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公开(公告)号： US20130140442A1公开(公告)日： 2013-06-06
- 发明人: Takeshi Yanagita , Keiji Mabuchi , Toru Shirakata , Takashi Abe , Takafumi Morikawa
- 申请人： Sony Corporation
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-264851 20111202; JP2011-273818 20111214
- 主分类号： H01L31/08
- IPC分类号： H01L31/08 ; H05K13/00 ; H03F3/16
摘要：
Disclosed herein is a solid-state imaging element including: a photoelectric conversion section configured to generate a charge according to received light; and a plurality of active elements configured to perform predetermined operation on the charge generated in the photoelectric conversion section, wherein a part of a gate electrode possessed by one of the active elements has a projection part buried in a substrate in which the photoelectric conversion section is formed. Thus, it is possible to suppress the occurrence of noise, and provide excellent image quality with a smaller area.
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