发明申请
- 专利标题： Integrated Reflow and Cleaning Process and Apparatus for Performing the Same
- 专利标题（中）： 集成回流和清洁过程及其执行装置
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申请号： US13313371申请日： 2011-12-07
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公开(公告)号： US20130146647A1公开(公告)日： 2013-06-13
- 发明人: Chung-Shi Liu , Chien Ling Hwang , Bor-Ping Jang , Ying-Jui Huang
- 申请人： Chung-Shi Liu , Chien Ling Hwang , Bor-Ping Jang , Ying-Jui Huang
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature.
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