发明申请
- 专利标题： CONDUCTIVE PASTES
- 专利标题（中）： 导电胶
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申请号： US13560273申请日： 2012-07-27
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公开(公告)号： US20130146820A1公开(公告)日： 2013-06-13
- 发明人: Kuo-Chan CHIOU , Jun-Rong Chen , Hsin-Mei Chen
- 申请人： Kuo-Chan CHIOU , Jun-Rong Chen , Hsin-Mei Chen
- 优先权： TW100145025 20111207
- 主分类号： H01B1/20
- IPC分类号： H01B1/20 ; H01B1/24 ; H01B1/22
摘要：
A conductive paste is provided. The conductive paste includes a conductive powder and a resin composition. The resin composition includes a polyester acrylate oligomer, a hydroxyalkyl acrylate (HAA) and a polyvinylpyrrolidone (PVP) derivative. The conductive powder and the resin composition have a weight ratio of 40-85:15-60. The polyester acrylate oligomer, the hydroxyalkyl acrylate (HAA) and the polyvinylpyrrolidone (PVP) derivative have a weight ratio of 15-70:10-60:3-40.
公开/授权文献
- US08784697B2 Conductive pastes 公开/授权日：2014-07-22
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