Abstract:
A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.
Abstract:
A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10
Abstract:
A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.
Abstract:
A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.
Abstract:
A composition for a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. The CNT-LC thermal composite structure is formed by using carbon nanotube with high thermal conductivity and liquid crystal polymer with the well-ordered structure. The thermal interface material thereby has a high thermal conductivity. The added amount of carbon nanotube is less than the added amount of metal or ceramic powders in the prior art for improving the dispersion process. The CNT-LC thermal composite structure and the phase change resin are compatible without phase separation. The thermal interface material has a phase change temperature about 45˜75° C. Any holes, gaps and dents on the surface of device are filled at the normal operating temperature of device to reduce the thermal resistance of the entire device.
Abstract:
An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.
Abstract:
A halogen-free and phosphorus-free resin formulation, prepared by the following method, is provided. The method includes mixing a carboxy anhydride derivative, diisocyanate, a styrene maleic anhydride (SMA) copolymer derivative and a solvent to form a mixture, and heating the mixture to form a resin formulation. The disclosure also provides a halogen-free and phosphorus-free composite material with a low dielectric constant and flame resistance prepared from the resin formulation.
Abstract:
A halogen-free and phosphorus-free resin formulation, prepared by the following method, is provided. The method includes mixing a carboxy anhydride derivative, diisocyanate, a styrene maleic anhydride (SMA) copolymer derivative and a solvent to form a mixture, and heating the mixture to form a resin formulation. The disclosure also provides a halogen-free and phosphorus-free composite material with a low dielectric constant and flame resistance prepared from the resin formulation.
Abstract:
Disclosed are encapsulation materials including an 80 to 99.5 weight percentage (wt %) of ethylene vinyl acetate copolymers (EVA) and a 0.5 to 20 weight percentage(wt %) of a photoluminescent polymer, wherein the EVA and the photoluminescent polymers are evenly blended. The encapsulation materials can be applied to packaging solar cells, and the encapsulating structure may protect the EVA from UV damage and enhance light utilization efficiency of the solar cell.
Abstract:
A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10