发明申请
- 专利标题： METHOD OF PROTECTING AGAINST VIA FAILURE AND STRUCTURE THEREFOR
- 专利标题（中）： 通过其失效和结构防范的方法
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申请号： US13313179申请日： 2011-12-07
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公开(公告)号： US20130147051A1公开(公告)日： 2013-06-13
- 发明人: MEHUL D. SHROFF , Douglas M. Reber , Edward O. Travis
- 申请人： MEHUL D. SHROFF , Douglas M. Reber , Edward O. Travis
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/768
摘要：
A method is for forming a decoy via and a functional via. The method includes forming the functional via between a metal portion of a first interconnect layer and a portion of a second interconnect layer. The method further includes forming the decoy via in a protection region between the metal portion of the first interconnect layer and a metal portion of the third interconnect level.
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