Invention Application
- Patent Title: THREE DIMENSIONAL MEMORY ARRAY ADJACENT TO TRENCH SIDEWALLS
- Patent Title (中): 三维尺寸记忆阵列
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Application No.: US13330525Application Date: 2011-12-19
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Publication No.: US20130153846A1Publication Date: 2013-06-20
- Inventor: Wei-Chih CHIEN , Ming-Hsiu Lee , Shih-Hung Chen
- Applicant: Wei-Chih CHIEN , Ming-Hsiu Lee , Shih-Hung Chen
- Applicant Address: TW HSINCHU
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW HSINCHU
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L21/8239

Abstract:
A self-aligning stacked memory cell array structure and method for fabricating such structure. The memory cell array includes a stack of memory cells disposed adjacent to opposing sides of a conductive line that is formed within a trench. The memory cells are stacked such that the memory element surface of each memory cell forms a portion of the sidewall of the conductive line. The conductive line is formed within the trench such that electrical contact is made across the entire memory element surface of each memory cell. Such structure and method for making such structure is a self-aligning process that does not require the use of any additional masks.
Public/Granted literature
- US09035275B2 Three dimensional memory array adjacent to trench sidewalls Public/Granted day:2015-05-19
Information query
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