发明申请
- 专利标题： SEMICONDUCTOR MODULE
- 专利标题（中）： 半导体模块
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申请号： US13819221申请日： 2010-09-02
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公开(公告)号： US20130154081A1公开(公告)日： 2013-06-20
- 发明人: Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
- 申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
- 申请人地址： JP Toyota-shi
- 专利权人： TOYOTA JIDOSHI KABUSHIKI KAISHA
- 当前专利权人： TOYOTA JIDOSHI KABUSHIKI KAISHA
- 当前专利权人地址： JP Toyota-shi
- 国际申请： PCT/JP2010/065061 WO 20100902
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.
公开/授权文献
- US08810026B2 Semiconductor module 公开/授权日：2014-08-19
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