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公开(公告)号：US08810026B2
公开(公告)日：2014-08-19
申请号：US13819221
申请日：2010-09-02
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/36 , H01L23/4006 , H01L23/4334 , H01L23/473 , H01L23/49537 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L25/115 , H01L25/117 , H01L2224/29099 , H01L2224/30181 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/01013 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.
摘要翻译： 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。
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公开(公告)号：US20130154084A1
公开(公告)日：2013-06-20
申请号：US13819209
申请日：2010-09-02
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
IPC分类号： H01L23/40
CPC分类号： H01L23/40 , G01N29/07 , G01N2291/044 , G01N2291/2697 , H01L23/3121 , H01L23/3735 , H01L23/4006 , H01L23/4334 , H01L23/473 , H01L23/49548 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.
摘要翻译： 半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上 半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。
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公开(公告)号：US09331001B2
公开(公告)日：2016-05-03
申请号：US13819209
申请日：2010-09-02
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
IPC分类号： H01L23/40 , H01L23/31 , H01L23/373 , H01L23/433 , H01L23/473 , H01L23/495 , H01L25/07 , H01L23/00
CPC分类号： H01L23/40 , G01N29/07 , G01N2291/044 , G01N2291/2697 , H01L23/3121 , H01L23/3735 , H01L23/4006 , H01L23/4334 , H01L23/473 , H01L23/49548 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.
摘要翻译： 半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上 半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。
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公开(公告)号：US20130154081A1
公开(公告)日：2013-06-20
申请号：US13819221
申请日：2010-09-02
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/36 , H01L23/4006 , H01L23/4334 , H01L23/473 , H01L23/49537 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L25/115 , H01L25/117 , H01L2224/29099 , H01L2224/30181 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/01013 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.
摘要翻译： 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。
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公开(公告)号：US09059145B2
公开(公告)日：2015-06-16
申请号：US13590707
申请日：2012-08-21
IPC分类号： H05K7/20 , H01L23/433 , H01L23/051 , H01L25/07 , H01L23/473 , H01L23/31 , H01L21/56
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/051 , H01L23/3107 , H01L25/071 , H01L2224/33 , H01L2924/0002 , H01L2924/181 , Y10T29/49002 , H01L2924/00 , H01L2924/00012
摘要： A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.
摘要翻译： 公开了一种功率模块，其包括半导体元件，第一冷却构件和被配置为将半导体元件夹在其间的第二冷却构件，构造成将半导体元件支撑在第一冷却构件和第二冷却构件之间的框架构件和模制树脂 设置在第一冷却构件和第二冷却构件之间，其中框架构件包括调节构件，其调节第一冷却构件和第二冷却构件之间的距离。
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公开(公告)号：US20140145193A1
公开(公告)日：2014-05-29
申请号：US14129342
申请日：2012-04-26
IPC分类号： H01L21/66 , H01L23/495
CPC分类号： H01L23/49562 , H01L22/34 , H01L23/3114 , H01L23/4334 , H01L23/492 , H01L23/495 , H01L23/4951 , H01L23/4952 , H01L23/49537 , H01L23/49541 , H01L23/49551 , H01L23/49555 , H01L23/49568 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/371 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2224/859 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A problem to be solved is to provide a lead frame and a power module having high material yield.A lead frame includes a plurality of first leads extending to one side of an area in which a semiconductor device is disposed in a planar view; a plurality of second leads extending to another side that is opposite the one side of the area in which the semiconductor device is disposed in a planar view; a third lead arranged outside of one of the plurality of first leads positioned at an edge of the plurality of first leads in a planar view; and a wiring part that is connected to the third lead, acts as a part of a guide frame of the plurality of first leads, the plurality of second leads, and the third lead, and acts as a wiring connected to the third lead after parts of the guide frame other than the part of the guide frame have been cut off.
摘要翻译： 要解决的问题是提供具有高材料产量的引线框架和功率模块。 引线框架包括延伸到其中半导体器件在平面图中设置的区域的一侧的多个第一引线; 多个第二引线延伸到在平面图中与半导体器件设置的区域的一侧相对的另一侧; 第三引线，布置在平面图中位于所述多个第一引线的边缘的所述多个第一引线中的一个之外; 以及连接到第三引线的布线部分，用作多个第一引线，多个第二引线和第三引线的引导框架的一部分，并且用作连接到第三引线的布线部件 引导框架除了引导框架的一部分已被切断。
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公开(公告)号：US20140197525A1
公开(公告)日：2014-07-17
申请号：US14117165
申请日：2011-05-16
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/3107 , H01L23/492 , H01L23/49524 , H01L23/49562 , H01L24/33 , H01L24/45 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/4917 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.
摘要翻译： 一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置 ，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到 第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。
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公开(公告)号：US08878347B2
公开(公告)日：2014-11-04
申请号：US14117165
申请日：2011-05-16
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/3107 , H01L23/492 , H01L23/49524 , H01L23/49562 , H01L24/33 , H01L24/45 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/4917 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.
摘要翻译： 一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置 ，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到 第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。
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公开(公告)号：US08884411B2
公开(公告)日：2014-11-11
申请号：US14112408
申请日：2012-04-18
IPC分类号： H01L23/02 , H01L23/00 , H01L23/495
CPC分类号： H01L24/30 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/34 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/06181 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73221 , H01L2224/73265 , H01L2224/83 , H01L2224/83205 , H01L2224/83801 , H01L2224/84205 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device includes a first semiconductor element; a first thick plate portion that is electrically connected to an electrode on a lower surface side of the first semiconductor element, and is formed by a conductor; a second semiconductor element that is arranged such that a main surface of the second semiconductor element faces a main surface of the first semiconductor element; a second thick plate portion that is electrically connected to an electrode on a lower surface side of the second semiconductor element, and is formed by a conductor; a third thick plate portion that is electrically connected to an electrode on an upper surface side of the first semiconductor element, and is formed by a conductor; a fourth thick plate portion that is electrically connected to an electrode on an upper surface side of the second semiconductor element, and is formed by a conductor; a first thin plate portion that is provided on the second thick plate portion, is formed by a conductor, and is thinner than the second thick plate portion; and a second thin plate portion that is provided on the third thick plate portion, is formed by a conductor, and is thinner than the third thick plate portion. The first thin plate portion and the second thin plate portion are fixed together and electrically connected.
摘要翻译： 半导体器件包括第一半导体元件; 与第一半导体元件的下表面侧的电极电连接并由导体形成的第一厚板部; 第二半导体元件，被布置成使得第二半导体元件的主表面面对第一半导体元件的主表面; 第二厚板部分，电连接到第二半导体元件的下表面侧的电极，并由导体形成; 第三厚板部，与第一半导体元件的上表面侧的电极电连接，由导体形成; 与第二半导体元件的上表面侧的电极电连接并由导体形成的第四厚板部; 设置在第二厚板部分上的第一薄板部分由导体形成，并且比第二厚板部分薄; 并且设置在第三厚板部分上的第二薄板部分由导体形成，并且比第三厚板部分薄。 第一薄板部分和第二薄板部分固定在一起并电连接。
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公开(公告)号：US20140035112A1
公开(公告)日：2014-02-06
申请号：US14112408
申请日：2012-04-18
IPC分类号： H01L23/00
CPC分类号： H01L24/30 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/34 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/06181 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73221 , H01L2224/73265 , H01L2224/83 , H01L2224/83205 , H01L2224/83801 , H01L2224/84205 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device includes a first semiconductor element; a first thick plate portion that is electrically connected to an electrode on a lower surface side of the first semiconductor element, and is formed by a conductor; a second semiconductor element that is arranged such that a main surface of the second semiconductor element faces a main surface of the first semiconductor element; a second thick plate portion that is electrically connected to an electrode on a lower surface side of the second semiconductor element, and is formed by a conductor; a third thick plate portion that is electrically connected to an electrode on an upper surface side of the first semiconductor element, and is formed by a conductor; a fourth thick plate portion that is electrically connected to an electrode on an upper surface side of the second semiconductor element, and is formed by a conductor; a first thin plate portion that is provided on the second thick plate portion, is formed by a conductor, and is thinner than the second thick plate portion; and a second thin plate portion that is provided on the third thick plate portion, is formed by a conductor, and is thinner than the third thick plate portion. The first thin plate portion and the second thin plate portion are fixed together and electrically connected.
摘要翻译： 半导体器件包括第一半导体元件; 与第一半导体元件的下表面侧的电极电连接并由导体形成的第一厚板部; 第二半导体元件，被布置成使得第二半导体元件的主表面面对第一半导体元件的主表面; 第二厚板部分，电连接到第二半导体元件的下表面侧的电极，并由导体形成; 第三厚板部，与第一半导体元件的上表面侧的电极电连接，由导体形成; 与第二半导体元件的上表面侧的电极电连接并由导体形成的第四厚板部; 设置在第二厚板部分上的第一薄板部分由导体形成，并且比第二厚板部分薄; 并且设置在第三厚板部分上的第二薄板部分由导体形成，并且比第三厚板部分薄。 第一薄板部分和第二薄板部分固定在一起并电连接。
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