发明申请
- 专利标题： Fiber to Wafer Interface
- 专利标题（中）： 光纤到晶圆接口
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申请号： US13331164申请日： 2011-12-20
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公开(公告)号： US20130156365A1公开(公告)日： 2013-06-20
- 发明人: Tymon Barwicz , Darrell R. Childers , Dan Kurtz
- 申请人： Tymon Barwicz , Darrell R. Childers , Dan Kurtz
- 申请人地址： US NC Hickory US NY Armonk
- 专利权人： US CONEC, LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： US CONEC, LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NC Hickory US NY Armonk
- 主分类号： G02B6/12
- IPC分类号： G02B6/12
摘要：
An interface device includes a body portion having a single-mode waveguide portion including a substantially optically transparent material, a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material, an engagement feature operative to engage a portion of a wafer, and a guide portion operative to engage a portion of an optical fiber ferrule.
公开/授权文献
- US08724937B2 Fiber to wafer interface 公开/授权日：2014-05-13