Invention Application
- Patent Title: LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 发光二极管及其制造方法
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Application No.: US13570214Application Date: 2012-08-08
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Publication No.: US20130161652A1Publication Date: 2013-06-27
- Inventor: Ya-Wen LIN , Po-Min TU , Shih-Cheng HUANG , Chia-Hung HUANG , Shun-Kuei YANG
- Applicant: Ya-Wen LIN , Po-Min TU , Shih-Cheng HUANG , Chia-Hung HUANG , Shun-Kuei YANG
- Applicant Address: TW Hsinchu Hsien 303
- Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- Current Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- Current Assignee Address: TW Hsinchu Hsien 303
- Priority: CN201110443704.2 20111227
- Main IPC: H01L33/02
- IPC: H01L33/02

Abstract:
A light emitting diode (LED) includes a substrate, a buffer layer and an epitaxial structure. The substrate has a first surface with a patterning structure formed thereon. The patterning structure includes a plurality of projections. The buffer layer is arranged on the first surface of the substrate. The epitaxial structure is arranged on the buffer layer. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer arranged on the buffer layer in sequence. The first semiconductor layer has a second surface attached to the active layer. A distance between a peak of each the projections and the second surface of the first semiconductor layer is ranged from 0.5 μm to 2.5 μm.
Public/Granted literature
- US08946737B2 Light emitting diode and manufacturing method thereof Public/Granted day:2015-02-03
Information query
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