公开(公告)号：US20130032779A1

公开(公告)日：2013-02-07

申请号：US13457431

申请日：2012-04-26

Applicant: Chia-Hung HUANG ,  Shih-Cheng Huang ,  Po-Min TU ,  Shun-Kuei YANG ,  Ya-Wen LIN

Inventor： Chia-Hung HUANG ,  Shih-Cheng Huang ,  Po-Min TU ,  Shun-Kuei YANG ,  Ya-Wen LIN

IPC: H01L33/06 ,  H01L33/32 ,  H01L33/46

CPC classification number: H01L33/007 ,  H01L21/76856 ,  H01L33/0075 ,  H01L33/10 ,  H01L33/22

Abstract: A light emitting diode (LED) comprises a substrate, an epitaxial layer and an aluminum nitride (AlN) layer sequentially disposed on the substrate. The AlN layer comprises a plurality of stacks separated from each other, wherein the epitaxial layer entirely covers the plurality of stacks of the AlN layer. The AlN layer with a plurality of stacks reflects upwardly light generated by the epitaxial layer and downwardly toward the substrate to an outside of LED through a top plan of the LED. A method for forming the LED is also disclosed.

Abstract translation: 发光二极管（LED）包括依次设置在基板上的基板，外延层和氮化铝（AlN）层。 AlN层包括彼此分离的多个叠层，其中外延层完全覆盖AlN层的多个叠层。 具有多个堆叠的AlN层通过LED的顶部平面反射向上反射由外延层产生的向上的光并且朝向衬底向下反射到LED的外部。 还公开了一种用于形成LED的方法。

公开(公告)号：US08946737B2

公开(公告)日：2015-02-03

申请号：US13570214

申请日：2012-08-08

Applicant: Ya-Wen Lin ,  Po-Min Tu ,  Shih-Cheng Huang ,  Chia-Hung Huang ,  Shun-Kuei Yang

Inventor： Ya-Wen Lin ,  Po-Min Tu ,  Shih-Cheng Huang ,  Chia-Hung Huang ,  Shun-Kuei Yang

IPC: H01L33/00

CPC classification number: H01L33/22 ,  H01L33/007

Abstract: A light emitting diode (LED) includes a substrate, a buffer layer and an epitaxial structure. The substrate has a first surface with a patterning structure formed thereon. The patterning structure includes a plurality of projections. The buffer layer is arranged on the first surface of the substrate. The epitaxial structure is arranged on the buffer layer. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer arranged on the buffer layer in sequence. The first semiconductor layer has a second surface attached to the active layer. A distance between a peak of each the projections and the second surface of the first semiconductor layer is ranged from 0.5 μm to 2.5 μm.

Abstract translation: 发光二极管（LED）包括衬底，缓冲层和外延结构。 衬底具有形成在其上的图案化结构的第一表面。 图案形成结构包括多个突起。 缓冲层布置在基板的第一表面上。 外延结构布置在缓冲层上。 外延结构包括顺序地布置在缓冲层上的第一半导体层，有源层和第二半导体层。 第一半导体层具有附着到有源层的第二表面。 每个突起的峰值与第一半导体层的第二表面之间的距离为0.5μm至2.5μm。

公开(公告)号：US20120164764A1

公开(公告)日：2012-06-28

申请号：US13216248

申请日：2011-08-24

Applicant: PO-MIN TU ,  SHIH-CHENG HUANG ,  YA-WEN LIN ,  CHIA-HUNG HUANG ,  SHUN-KUEI YANG

Inventor： PO-MIN TU ,  SHIH-CHENG HUANG ,  YA-WEN LIN ,  CHIA-HUNG HUANG ,  SHUN-KUEI YANG

IPC: H01L33/62

CPC classification number: H01L33/24 ,  H01L33/005

Abstract: A method for fabricating a semiconductor lighting chip includes steps of: providing a substrate with a first block layer dividing an upper surface of the substrate into a plurality of epitaxial regions; forming a first semiconductor layer on the epitaxial regions; forming a second block layer partly covering the first semiconductor layer; forming a lighting structure on an uncovered portion of the first semiconductor layer; removing the first and the second block layers thereby defining clearances at the bottom surfaces of the first semiconductor layer and the lighting structure; and permeating etching solution into the first and second clearances to etch the first semiconductor layer and the lighting structure, thereby to form each of the first semiconductor layer and the lighting structure with an inverted frustum-shaped structure.

Abstract translation: 一种制造半导体照明芯片的方法包括以下步骤：向衬底提供将衬底的上表面分成多个外延区域的第一块层; 在所述外延区上形成第一半导体层; 形成部分地覆盖所述第一半导体层的第二块层; 在所述第一半导体层的未覆盖部分上形成照明结构; 去除第一和第二块层，从而在第一半导体层和照明结构的底表面处限定间隙; 并将渗透的蚀刻溶液浸入第一和第二间隙中以蚀刻第一半导体层和照明结构，由此形成具有倒立的截头锥形结构的第一半导体层和照明结构中的每一个。

公开(公告)号：US20120025215A1

公开(公告)日：2012-02-02

申请号：US13029124

申请日：2011-02-17

Applicant: CHIEN-MIN CHEN ,  YA-WEN LIN

Inventor： CHIEN-MIN CHEN ,  YA-WEN LIN

IPC: H01L33/64 ,  H01L23/48 ,  H01L23/34

CPC classification number: H01L33/642 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor package includes a substrate, a number of electrodes formed in the substrate, a heat dissipating member fixed on the substrate, and at least one semiconductor chip mounted on the heat dissipating member and electrically connected to the electrodes. The heat dissipating member defines a receiving through hole and includes a conducting portion formed at the bottom of the receiving through hole. The at least one semiconductor chip is mounted on the conducting portion. The conducting portion efficiently conducts the heat generated by the semiconductor chip to the heat dissipating member and improves the heat dissipating efficiency of the semiconductor package.

Abstract translation: 半导体封装包括衬底，形成在衬底中的多个电极，固定在衬底上的散热构件以及安装在散热构件上并电连接到电极的至少一个半导体芯片。 散热构件限定了接收通孔，并且包括形成在接收通孔的底部的导电部分。 至少一个半导体芯片安装在导电部分上。 导电部分有效地将半导体芯片产生的热量传导到散热构件，并提高半导体封装的散热效率。

公开(公告)号：US20110316024A1

公开(公告)日：2011-12-29

申请号：US12986187

申请日：2011-01-07

Applicant: TZU-CHIEN HUNG ,  YA-WEN LIN

Inventor： TZU-CHIEN HUNG ,  YA-WEN LIN

IPC: H01L33/48

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An LED package includes a transparent substrate, an LED die, and an encapsulating layer. The transparent substrate has a first surface defining a recess therein, a second surface opposite to the first surface, and a lateral surface interconnecting the first and second surfaces. The LED die is arranged on the bottom of the recess. The encapsulating layer is in the recess and covers the LED die. The LED package further includes a metal layer formed on the second surface and the lateral surface of the substrate. A pair of electrodes is located at the bottom of the recess and extends through the metal layer. An insulated material is filled between the transparent substrate and the electrodes. Light emitted from the LED die is transmitted through the transparent substrate and reflected by the metal layer.

Abstract translation: LED封装包括透明基板，LED管芯和封装层。 透明基板具有在其中限定凹部的第一表面，与第一表面相对的第二表面和互连第一和第二表面的侧表面。 LED芯片设置在凹槽的底部。 封装层位于凹槽中并覆盖LED管芯。 LED封装还包括形成在基板的第二表面和侧表面上的金属层。 一对电极位于凹槽的底部并延伸穿过金属层。 绝缘材料填充在透明基板和电极之间。 从LED管芯发出的光透过透明基板并被金属层反射。

公开(公告)号：US20070155326A1

公开(公告)日：2007-07-05

申请号：US11616362

申请日：2006-12-27

Applicant: Chih-Hsiang Lin ,  Alexander I-Chi Lai ,  Chao-Kuang Yang ,  Ya-Wen Lin

Inventor： Chih-Hsiang Lin ,  Alexander I-Chi Lai ,  Chao-Kuang Yang ,  Ya-Wen Lin

IPC: H04B7/00

CPC classification number: H04W76/10 ,  H04W4/12 ,  H04W84/18

Abstract: An instant message monitoring and controlling system includes an instant message monitoring and controlling module, a user operation interface and a bluetooth module. The instant message monitoring and controlling module is used for monitoring and controlling plural instant message tools. The user operation interface is used for defining a bluetooth device therevia. The bluetooth module automatically searches the pairing codes required for connection with the bluetooth device. When the instant message monitoring and controlling module receives data from the instant message tools, one of the instant message tools is communicated with the bluetooth device.

Abstract translation: 即时消息监视和控制系统包括即时消息监视和控制模块，用户操作界面和蓝牙模块。 即时消息监视和控制模块用于监视和控制多个即时消息工具。 用户操作界面用于定义蓝牙设备。 蓝牙模块会自动搜索与蓝牙设备连接所需的配对码。 当即时消息监视和控制模块从即时消息工具接收数据时，即时消息工具之一与蓝牙设备通信。

公开(公告)号：US08916400B2

公开(公告)日：2014-12-23

申请号：US13457431

申请日：2012-04-26

Applicant: Chia-Hung Huang ,  Shih-Cheng Huang ,  Po-Min Tu ,  Shun-Kuei Yang ,  Ya-Wen Lin

Inventor： Chia-Hung Huang ,  Shih-Cheng Huang ,  Po-Min Tu ,  Shun-Kuei Yang ,  Ya-Wen Lin

IPC: H01L33/10 ,  H01L33/00 ,  H01L21/768 ,  H01L33/22

CPC classification number: H01L33/007 ,  H01L21/76856 ,  H01L33/0075 ,  H01L33/10 ,  H01L33/22

Abstract: A light emitting diode (LED) comprises a substrate, an epitaxial layer and an aluminum nitride (AlN) layer sequentially disposed on the substrate. The AlN layer comprises a plurality of stacks separated from each other, wherein the epitaxial layer entirely covers the plurality of stacks of the AlN layer. The AlN layer with a plurality of stacks reflects upwardly light generated by the epitaxial layer and downwardly toward the substrate to an outside of LED through a top plan of the LED. A method for forming the LED is also disclosed.

Abstract translation: 发光二极管（LED）包括依次设置在基板上的基板，外延层和氮化铝（AlN）层。 AlN层包括彼此分离的多个叠层，其中外延层完全覆盖AlN层的多个叠层。 具有多个堆叠的AlN层通过LED的顶部平面反射向上反射由外延层产生的向上的光并且朝向衬底向下反射到LED的外部。 还公开了一种用于形成LED的方法。

公开(公告)号：US08772793B2

公开(公告)日：2014-07-08

申请号：US13272229

申请日：2011-10-13

Applicant: Shih-Cheng Huang ,  Po-Min Tu ,  Ya-Wen Lin

Inventor： Shih-Cheng Huang ,  Po-Min Tu ,  Ya-Wen Lin

IPC: H01L27/15

CPC classification number: H01L33/62 ,  H01L24/24 ,  H01L33/385 ,  H01L33/42 ,  H01L33/54 ,  H01L2924/12041 ,  H01L2924/00

Abstract: An exemplary LED includes an electrode layer, an LED die, a transparent electrically conductive layer, and an electrically insulating layer. The electrode layer includes a first section and a second section electrically insulated from the first section. The LED die is arranged on and electrically connected to the second section of the electrode layer. The transparent electrically conductive layer is formed on the LED die and electrically connects the LED die to the first section of the electrode layer. The electrically insulating layer is located between the LED die and the transparent electrically conductive layer to insulate the transparent electrically conductive layer from the second section of the electrode layer.

Abstract translation: 示例性的LED包括电极层，LED管芯，透明导电层和电绝缘层。 电极层包括第一部分和与第一部分电绝缘的第二部分。 LED管芯设置在电极层的第二部分上并与之电连接。 透明导电层形成在LED芯片上，并将LED管芯电连接到电极层的第一部分。 电绝缘层位于LED管芯和透明导电层之间，以使透明导电层与电极层的第二部分绝缘。

公开(公告)号：US08643022B2

公开(公告)日：2014-02-04

申请号：US13300731

申请日：2011-11-21

Applicant: Po-Min Tu ,  Shih-Cheng Huang ,  Ya-Wen Lin

Inventor： Po-Min Tu ,  Shih-Cheng Huang ,  Ya-Wen Lin

IPC: H01L33/02

CPC classification number: H01L33/52 ,  H01L24/24 ,  H01L33/38 ,  H01L33/382 ,  H01L33/42 ,  H01L33/44 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An LED comprises an electrode layer comprising a first a second sections electrically insulated from each other; an electrically conductive layer on the second section, an electrically conductive pole protruding from the electrically conductive layer; an LED die comprising an electrically insulating substrate on the electrically conductive layer, and a P-N junction on the electrically insulating substrate, the P-N junction comprising a first electrode and a second electrode, the electrically conductive pole extending through the electrically insulating substrate to electrically connect the first electrode to the second section; a transparent electrically conducting layer on the LED die, the transparent electrically conducting layer electrically connecting the second electrode to the first section; and an electrically insulating layer between the LED die, the electrically conductive layer, and the transparent electrically conducting layer, wherein the electrically insulating layer insulates the transparent electrically conducting layer from the electrically conductive layer and the second section.

Abstract translation: LED包括电极层，电极层包括彼此电绝缘的第一部分和第二部分; 所述第二部分上的导电层，从所述导电层突出的导电极; 包括在所述导电层上的电绝缘衬底的LED管芯和所述电绝缘衬底上的PN结，所述PN结包括第一电极和第二电极，所述导电极延伸穿过所述电绝缘衬底以电连接 第一电极到第二部分; 在所述LED管芯上的透明导电层，所述透明导电层将所述第二电极与所述第一部分电连接; 以及在LED管芯，导电层和透明导电层之间的电绝缘层，其中电绝缘层使透明导电层与导电层和第二部分绝缘。

公开(公告)号：US20130234150A1

公开(公告)日：2013-09-12

申请号：US13600137

申请日：2012-08-30

Applicant: CHIA-HUNG HUANG ,  SHIH-CHENG HUANG ,  PO-MIN TU ,  YA-WEN LIN ,  SHUN-KUEI YANG

Inventor： CHIA-HUNG HUANG ,  SHIH-CHENG HUANG ,  PO-MIN TU ,  YA-WEN LIN ,  SHUN-KUEI YANG

IPC: H01L33/22 ,  H01L33/58

CPC classification number: H01L33/58 ,  H01L33/10 ,  H01L33/22 ,  H01L33/32

Abstract: A light emitting diode includes a substrate, a transitional layer on the substrate and an epitaxial layer on the transitional layer. The transitional layer includes a planar area with a flat top surface and a patterned area with a rugged top surface. An AlN material includes a first part consisting of a plurality of spheres and a second part consisting of a plurality of slugs. The spheres are on a top surface of the transitional layer, both at the planar area and the patterned area. The slugs are in grooves defined in the patterned area. Air gaps are formed between the slugs and a bottom surface of the epitaxial layer. The spheres and slugs of the AlN material help reflection of light generated by the epitaxial layer to a light output surface of the LED.

Abstract translation: 发光二极管包括衬底，衬底上的过渡层和过渡层上的外延层。 过渡层包括具有平坦顶表面的平坦区域和具有粗糙顶表面的图案区域。 AlN材料包括由多个球体组成的第一部分和由多个球团组成的第二部分。 球体在平坦区域和图案化区域处于过渡层的顶表面上。 s条位于图案区域中限定的凹槽中。 在s条和外延层的底表面之间形成气隙。 AlN材料的球体和块状物有助于将由外延层产生的光反射到LED的光输出表面。