Invention Application
- Patent Title: CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 芯片电感器及其制造方法
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Application No.: US13725478Application Date: 2012-12-21
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Publication No.: US20130162382A1Publication Date: 2013-06-27
- Inventor: Hye Yeon Cha , Kang Heon Hur , Sung Jin Park , Dong Jin Jeong , Jung Min Park , Hyeog Soo Shin , Sung Yong An , Hwan Soo Lee , Young Do KWEON , Jin Woo Hahn
- Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD
- Applicant Address: KR Gyeonggi-do
- Assignee: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2011-0140409 20111222
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F41/04
Abstract:
The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
Public/Granted literature
- US09183979B2 Chip inductor and method for manufacturing the same Public/Granted day:2015-11-10
Information query
