发明申请
- 专利标题： MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTRICAL INTERCONNECTIONS AND METHOD FOR FABRICATING THE SAME
- 专利标题（中）： 具有电气互连的微电子机电系统装置及其制造方法
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申请号： US13459271申请日： 2012-04-30
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公开(公告)号： US20130167632A1公开(公告)日： 2013-07-04
- 发明人: Chao-Ta Huang , Yu-Wen Hsu , Chin-Fu Kuo
- 申请人： Chao-Ta Huang , Yu-Wen Hsu , Chin-Fu Kuo
- 申请人地址： TW Hsinchu
- 专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址： TW Hsinchu
- 优先权： TW100149587 20111229
- 主分类号： G01P3/42
- IPC分类号： G01P3/42 ; H01L21/306
摘要：
A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.
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