发明申请
- 专利标题： THERMAL COMPRESSION HEAD FOR FLIP CHIP BONDING
- 专利标题（中）： 用于卷芯片粘合的热压缩头
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申请号： US13348503申请日： 2012-01-11
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公开(公告)号： US20130175324A1公开(公告)日： 2013-07-11
- 发明人: Hui-Shan Chang , Chia-Lin Hung , Chung Chieh Huang
- 申请人： Hui-Shan Chang , Chia-Lin Hung , Chung Chieh Huang
- 申请人地址： TW Kaohsiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： B23K20/02
- IPC分类号： B23K20/02 ; B23K37/00
摘要：
The present invention provides a method and a thermal compression head for flip chip bonding. The thermal compression head includes a main body and a contact portion. The main body has a main body opening. The contact portion has a contact surface and a plurality of openings. The openings communicate with the main body opening. When the contact surface of the contact portion is used to adsorb a chip, the contact surface of the chip has a plurality of adsorbed zones corresponding to the contact surface openings. After the chip is bonded to a substrate, the protrusions of the adsorbed zones are relatively slight. Therefore, the interconnection between the chip and the substrate is ensured.
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