发明申请
US20130177666A1 Mold-Tool System Including Air Cavity Circuit, and Means for Forcing Relatively Cooler Air Stream to Air Cavity Circuit
审中-公开
包括空腔电路的模具工具系统,以及将相对冷却空气流强制到空气腔电路的手段
- 专利标题: Mold-Tool System Including Air Cavity Circuit, and Means for Forcing Relatively Cooler Air Stream to Air Cavity Circuit
- 专利标题(中): 包括空腔电路的模具工具系统,以及将相对冷却空气流强制到空气腔电路的手段
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申请号: US13825562申请日: 2011-10-10
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公开(公告)号: US20130177666A1公开(公告)日: 2013-07-11
- 发明人: Gregory Ray Hammond , Troy Richard Mercer
- 申请人: Gregory Ray Hammond , Troy Richard Mercer
- 申请人地址: CA ON Bolton
- 专利权人: HUSKY INJECTION MOLDING SYSTEMS LTD.
- 当前专利权人: HUSKY INJECTION MOLDING SYSTEMS LTD.
- 当前专利权人地址: CA ON Bolton
- 国际申请: PCT/US11/55555 WO 20111010
- 主分类号: B29C45/72
- IPC分类号: B29C45/72
摘要:
A mold-tool system (100), comprising: (i) a hot runner manifold assembly (102), (ii) a plate assembly (104) defining an air-cavity circuit (106), the plate assembly (104) being configured to support and surround, at least in part, the hot runner manifold assembly (102), and the air-cavity circuit (106) surrounding, at least in part, the hot runner manifold assembly (102); and (iii) means for forcing, in use, a relatively cooler air stream to the air-cavity circuit (106), wherein that the air-cavity circuit (106) is configured to: (i) increase, in use, thermal losses of the hot runner manifold assembly (102), and (ii) reduce time to cool down the hot runner manifold assembly (102) relative to heat lost as a result of natural convection associated with the hot runner manifold assembly (102).
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