摘要:
A mold-tool system (100), comprising: (i) a hot runner manifold assembly (102), (ii) a plate assembly (104) defining an air-cavity circuit (106), the plate assembly (104) being configured to support and surround, at least in part, the hot runner manifold assembly (102), and the air-cavity circuit (106) surrounding, at least in part, the hot runner manifold assembly (102); and (iii) means for forcing, in use, a relatively cooler air stream to the air-cavity circuit (106), wherein that the air-cavity circuit (106) is configured to: (i) increase, in use, thermal losses of the hot runner manifold assembly (102), and (ii) reduce time to cool down the hot runner manifold assembly (102) relative to heat lost as a result of natural convection associated with the hot runner manifold assembly (102).
摘要:
A mold-tool system (100), comprising: a nozzle position-adjustment assembly (104) being configured to selectively adjust position of a nozzle assembly (102) between: (i) a nozzle-loaded position, and (ii) a nozzle-unloaded position.
摘要:
A mold-tool system (100), comprising: a nozzle position-adjustment assembly (104) being configured to selectively adjust position of a nozzle assembly (102) between: (i) a nozzle-loaded position, and (ii) a nozzle-unloaded position.