Mold-Tool System Including Air Cavity Circuit, and Means for Forcing Relatively Cooler Air Stream to Air Cavity Circuit
    1.
    发明申请
    Mold-Tool System Including Air Cavity Circuit, and Means for Forcing Relatively Cooler Air Stream to Air Cavity Circuit 审中-公开
    包括空腔电路的模具工具系统,以及将相对冷却空气流强制到空气腔电路的手段

    公开(公告)号:US20130177666A1

    公开(公告)日:2013-07-11

    申请号:US13825562

    申请日:2011-10-10

    IPC分类号: B29C45/72

    摘要: A mold-tool system (100), comprising: (i) a hot runner manifold assembly (102), (ii) a plate assembly (104) defining an air-cavity circuit (106), the plate assembly (104) being configured to support and surround, at least in part, the hot runner manifold assembly (102), and the air-cavity circuit (106) surrounding, at least in part, the hot runner manifold assembly (102); and (iii) means for forcing, in use, a relatively cooler air stream to the air-cavity circuit (106), wherein that the air-cavity circuit (106) is configured to: (i) increase, in use, thermal losses of the hot runner manifold assembly (102), and (ii) reduce time to cool down the hot runner manifold assembly (102) relative to heat lost as a result of natural convection associated with the hot runner manifold assembly (102).

    摘要翻译: 一种模具工具系统(100),包括:(i)热流道歧管组件(102),(ii)限定空气腔电路(106)的板组件(104),所述板组件(104)被配置 至少部分地支撑和围绕所述热流道歧管组件(102)以及至少部分地围绕所述热流道歧管组件(102)的所述空气腔回路(106)。 和(iii)用于在使用中将相对较冷的空气流强制到所述空气腔回路(106)的装置,其中所述空气腔回路(106)构造成:(i)在使用中增加热损失 ,并且(ii)相对于由于与热流道歧管组件(102)相关联的自然对流而导致的热损失,减少了热流道歧管组件(102)的冷却时间。