Invention Application
- Patent Title: HEAT-DISSIPATING MODULE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 热消散模块及其制造方法
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Application No.: US13351204Application Date: 2012-01-16
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Publication No.: US20130180688A1Publication Date: 2013-07-18
- Inventor: Chia-Yu Lin , Lei-Lei Liu
- Applicant: Chia-Yu Lin , Lei-Lei Liu
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Main IPC: F28D15/04
- IPC: F28D15/04 ; B22D17/00 ; B22D19/00

Abstract:
In a heat-dissipating module and a method for manufacturing the same, a hollow aluminum tube is put on a corresponding heat pipe to form an aluminum-skinned heat pipe. Then, one or more aluminum-skinned heat pipes are disposed in a casting space of a die casting mold. Fins are disposed into the die casting mold. Molten aluminum materials are filled in the casting space of the die casting mold to form a heat-dissipating module. By using a die casting process, molten aluminum materials are used to cover at least one aluminum-skinned heat pipe and connect with the fins, thereby finishing the heat-dissipating module.
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