Invention Application
- Patent Title: HEADER UNIT AND HEAT EXCHANGER HAVING THE SAME
- Patent Title (中): HEADER UNIT和热交换器
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Application No.: US13740584Application Date: 2013-01-14
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Publication No.: US20130180695A1Publication Date: 2013-07-18
- Inventor: Kang Tae Seo , Hye Won Lee , Hayase Gaku
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0004993 20120116
- Main IPC: F28F9/02
- IPC: F28F9/02

Abstract:
A header unit having an improved assembly method of a body and a header and a heat exchanger having the same, capable of preventing a body from being incompletely bonded to a cover at an inner side of the header as a result of the instability of a manufacturing process, and thus capable of preventing the leaking of the refrigerant in between two tanks at an inside of the header. The heat exchanger includes a body, and a cover coupled to the body, wherein the body includes a base part forming a bottom surface of the body, and a middle partition protrudedly formed from the base part, and the cover includes a coupling groove to which the middle partition of the body is coupled while passing through the coupling groove.
Information query