Invention Application
- Patent Title: CIRCUIT BOARD STRUCTURE AND FABRICATION THEREOF
- Patent Title (中): 电路板结构及其制造
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Application No.: US13763846Application Date: 2013-02-11
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Publication No.: US20130183800A1Publication Date: 2013-07-18
- Inventor: Shih-Ping Hsu
- Applicant: UNIMICRON TECHNOLOGY CORP.
- Applicant Address: TW Taoyuan
- Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee Address: TW Taoyuan
- Main IPC: H01L21/50
- IPC: H01L21/50
Abstract:
A circuit board structure and a fabrication method thereof are disclosed. The circuit board structure includes a carrying board having a first and an opposite second surface and having at least one through cavity formed therein; a semiconductor chip disposed in the through cavity of the carrying board; an adhesive material filling the gap between the through cavity of the carrying board and the semiconductor chip to fix the semiconductor chip in the through cavity; and a reinforcing layer disposed on the second surface of the carrying board and the inactive surface of the semiconductor chip, thereby increasing the strength of the carrying board as well as the reliability of the circuit board.
Public/Granted literature
- US09484224B2 Method of fabricating a circuit board structure Public/Granted day:2016-11-01
Information query
IPC分类:
