发明申请
- 专利标题： SEMICONDUCTOR PACKAGE
- 专利标题（中）： 半导体封装
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申请号： US13733481申请日： 2013-01-03
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公开(公告)号： US20130193588A1公开(公告)日： 2013-08-01
- 发明人: Ji-Seok Hong , Kwang-chul Choi , Sangwon Kim , Hyun-Jung Song , Eun-Kyoung Choi
- 申请人： Samsung Electronics Co, Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2012-0008381 20120127
- 主分类号： H01L23/29
- IPC分类号： H01L23/29
摘要：
A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.
公开/授权文献
- US08816509B2 Semiconductor package including underfill layers 公开/授权日：2014-08-26