发明申请
- 专利标题: Multi-Chamber Substrate Processing System
- 专利标题(中): 多腔基底处理系统
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申请号: US13754771申请日: 2013-01-30
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公开(公告)号: US20130196078A1公开(公告)日: 2013-08-01
- 发明人: Joseph Yudovsky , Nag B. Patibandla , Pravin K. Narwankar , Li-Qun Xia , Toshiaki Fujita , Ralf Hofmann , Jeonghoon Oh , Srinivas Satya , Banqiu Wu
- 申请人: Joseph Yudovsky , Nag B. Patibandla , Pravin K. Narwankar , Li-Qun Xia , Toshiaki Fujita , Ralf Hofmann , Jeonghoon Oh , Srinivas Satya , Banqiu Wu
- 主分类号: C23C16/458
- IPC分类号: C23C16/458
摘要:
A substrate processing system for processing multiple substrates is provided and generally includes at least one substrate processing platform and at least one substrate staging platform. The substrate processing platform includes a rotary track system capable of supporting multiple substrate support assemblies and continuously rotating the substrate support assemblies, each carrying a substrate thereon. Each substrate is positioned on a substrates support assembly disposed on the rotary track system and being processed through at least one shower head station and at least one buffer station, which are positioned atop the rotary track system of the substrate processing platform. Multiple substrates disposed on the substrate support assemblies are processed in and out the substrate processing platform. The substrate staging platform includes at least one dual-substrate processing station, each dual-substrate processing station includes two substrate support assemblies for supporting two substrates thereon.
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