发明申请
- 专利标题： ELECTRONIC COMPONENT MODULE AND METHOD FOR PRODUCING SAME
- 专利标题（中）： 电子元件模块及其制造方法
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申请号： US13758131申请日： 2013-02-04
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公开(公告)号： US20130200504A1公开(公告)日： 2013-08-08
- 发明人: Takayuki OTSUKA , Fujio FURUKAWA , Ryuichi WADA , Makoto KITAZUME , Toshiki KOMIYAMA
- 申请人： Takayuki OTSUKA , Fujio FURUKAWA , Ryuichi WADA , Makoto KITAZUME , Toshiki KOMIYAMA
- 申请人地址： JP Tokyo
- 专利权人： MITSUMI ELECTRIC CO., LTD.
- 当前专利权人： MITSUMI ELECTRIC CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2012-025124 20120208; JP2012-126238 20120601
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/50
摘要：
An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.
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