公开(公告)号：US10186503B2

公开(公告)日：2019-01-22

申请号：US15739260

申请日：2016-07-14

申请人： Makoto Kitazume ,  Toshiki Komiyama

发明人： Makoto Kitazume ,  Toshiki Komiyama

IPC分类号： H01L23/31 ,  H01L25/18 ,  H01L23/498 ,  H01L25/065 ,  H05K3/40 ,  H01L23/538 ,  H01L25/16 ,  H01L23/00 ,  H01L25/00 ,  H05K3/28

摘要： The module is implemented on a circuit board, the module including a wiring board; an electronic component implemented on a first surface of the wiring board; an external connection electrode formed on a second surface of the wiring board; a solder bump connected to the external connection electrode; a bare chip implemented facedown on the second surface of the wiring board; and a resin covering a surface and a side surface of the bare chip and a side surface of the solder bump on the second surface of the wiring board, wherein a reverse surface of the bare chip and a connection surface of the solder bump are exposed from the resin such that the reverse surface of the bare chip and the connection surface of the solder bump are on a same plane, and wherein the module is implemented on the circuit board so that the reverse surface of the bare chip and the connection surface of the solder bump face the circuit board.

公开(公告)号：US20130200504A1

公开(公告)日：2013-08-08

申请号：US13758131

申请日：2013-02-04

申请人： Takayuki OTSUKA ,  Fujio FURUKAWA ,  Ryuichi WADA ,  Makoto KITAZUME ,  Toshiki KOMIYAMA

发明人： Takayuki OTSUKA ,  Fujio FURUKAWA ,  Ryuichi WADA ,  Makoto KITAZUME ,  Toshiki KOMIYAMA

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/544 ,  H01L23/552 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.

摘要翻译： 电子部件模块包括具有前表面和后表面的双面安装板; 安装在双面安装板的前表面和后表面上的部件; 密封安装在前表面和后表面上的部件的绝缘树脂; 以及引线框架，其结合到双面安装板的背面。 双面安装板的背面用绝缘树脂密封，使得引线框架不被绝缘树脂覆盖，并且绝缘树脂的厚度将安装在双面安装背面上的部件密封 板小于或等于引线框架的厚度。

公开(公告)号：US20190355887A1

公开(公告)日：2019-11-21

申请号：US16484189

申请日：2018-02-28

申请人： Makoto KITAZUME ,  Tadashi ONO ,  Toshiki KOMIYAMA ,  Yuki INUGAI

发明人： Makoto KITAZUME ,  Tadashi ONO ,  Toshiki KOMIYAMA ,  Yuki INUGAI

IPC分类号： H01L33/60 ,  H01L33/62 ,  H01L33/56 ,  H01L33/50 ,  H01L25/075

摘要： A method for manufacturing an optical module includes a step of mounting a light emitting device on a board having a plurality of electrodes on its surface in a facedown manner, a step of disposing a resin sheet containing a light conversion material so as to face the surface on which the light emitting device is mounted of the board and filling a space between the resin sheet and the board including the resin sheet and the light emitting device with a first light transmissive resin, a step of covering a surface opposite to a surface of the resin sheet covered with the first light transmissive resin with a second light transmissive resin, a step of forming a groove extending from a top surface of the second light transmissive resin to a predetermined depth of the board, a step of filling the groove with the light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin, a step of removing the light reflective resin on the second light transmissive resin, and a step of dicing the light emitting device by cutting along the light reflective resin such that an outer lateral surface is covered with the light reflective resin by leaving part of the light reflective resin filled in the groove.

公开(公告)号：US08847371B2

公开(公告)日：2014-09-30

申请号：US13758131

申请日：2013-02-04

申请人： Takayuki Otsuka ,  Fujio Furukawa ,  Ryuichi Wada ,  Makoto Kitazume ,  Toshiki Komiyama

发明人： Takayuki Otsuka ,  Fujio Furukawa ,  Ryuichi Wada ,  Makoto Kitazume ,  Toshiki Komiyama

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/544 ,  H01L21/50 ,  H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/544 ,  H01L23/552 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.

摘要翻译： 电子部件模块包括具有前表面和后表面的双面安装板; 安装在双面安装板的前表面和后表面上的部件; 密封安装在前表面和后表面上的部件的绝缘树脂; 以及引线框架，其结合到双面安装板的背面。 双面安装板的背面用绝缘树脂密封，使得引线框架不被绝缘树脂覆盖，并且绝缘树脂的厚度将安装在双面安装背面上的部件密封 板小于或等于引线框架的厚度。